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Micro heat exchanger by using MEMS impinging jets

Wu, S. and Mai, J. and Tai, Y. C. and Ho, C. M. (1999) Micro heat exchanger by using MEMS impinging jets. In: IEEE International Conference on Micro Electro Mechanical Systems, 12th. MEMS '99. IEEE , Piscataway, NJ, pp. 171-176. ISBN 0-7803-5194-0 http://resolver.caltech.edu/CaltechAUTHORS:WUSmems99

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Abstract

A micro impinging-jet heat exchanger is presented here. Heat transfer is studied for single jet, slot arrays and jet arrays. In order to facilitate micro heat transfer measurements with these devices, a MEMS sensor chip, which has an 8 x 8 temperature-sensor array on one side, and an integrated heater on the other side has been designed and fabricated. This sensor chip allows 2-D surface temperature measurement with various jets impinging on it. It is found that micro impinging jets can be highly efficient when compared to existing macro impinging-jet microelectronics packages such as IBM 4381. For example, using a single nozzle jet (500-μm diameter driven by 5 psig pressure), the sensor chip (2 x 2 cm^2) temperature can be cooled down from 70 to 33°C. The cooling becomes more efficient when nozzle arrays (4x5 over 1 cm^2 area) are used under the same driving pressure. Interestingly, although higher driving pressure gives better cooling (lower surface temperature), the cooling efficiency, defined as h/0.5pv^2, is actually higher for lower driving pressure.


Item Type:Book Section
Additional Information:© 1999 IEEE. Reprinted with Permission. Publication Date: 17-21 Jan. 1999. This work was sponsored by the Air Force Office of Scientific Research, USAF, under grant/contract number 49620-96-1-0376. The authors would like to thank Trevor Roper, Ronghua Zhang, Charles Grosjean, and Qiao Lin for their contribution to the work.
Subject Keywords:arrays; cooling; heat exchangers; heat sinks; jets; microfluidics; microsensors; nozzles; temperature distribution; temperature sensors; thermal management (packaging); 2D surface temperature measurement; 500 micron; 70 to 33 C; MEMS impinging jets; MEMS sensor chip; Parylene layer; Si; chip cooling; cooling efficiency; driving pressure; heat transfer; integrated heater; jet arrays; micro heat exchanger; micro-cooling; microelectronics packages; nozzle arrays; nozzle diameter; nozzle spacing; polysilicon heater; single jet; slot arrays; temperature distribution; temperature-sensor array
Record Number:CaltechAUTHORS:WUSmems99
Persistent URL:http://resolver.caltech.edu/CaltechAUTHORS:WUSmems99
Alternative URL:http://dx.doi.org/10.1109/MEMSYS.1999.746799
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:10445
Collection:CaltechAUTHORS
Deposited By: Kristin Buxton
Deposited On:06 May 2008
Last Modified:26 Dec 2012 10:00

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