Wu, S. and Mai, J. and Tai, Y. C. and Ho, C. M. (1999) Micro heat exchanger by using MEMS impinging jets. In: IEEE International Conference on Micro Electro Mechanical Systems, 12th. MEMS '99. IEEE , Piscataway, NJ, pp. 171-176. ISBN 0-7803-5194-0 http://resolver.caltech.edu/CaltechAUTHORS:WUSmems99
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A micro impinging-jet heat exchanger is presented here. Heat transfer is studied for single jet, slot arrays and jet arrays. In order to facilitate micro heat transfer measurements with these devices, a MEMS sensor chip, which has an 8 x 8 temperature-sensor array on one side, and an integrated heater on the other side has been designed and fabricated. This sensor chip allows 2-D surface temperature measurement with various jets impinging on it. It is found that micro impinging jets can be highly efficient when compared to existing macro impinging-jet microelectronics packages such as IBM 4381. For example, using a single nozzle jet (500-μm diameter driven by 5 psig pressure), the sensor chip (2 x 2 cm^2) temperature can be cooled down from 70 to 33°C. The cooling becomes more efficient when nozzle arrays (4x5 over 1 cm^2 area) are used under the same driving pressure. Interestingly, although higher driving pressure gives better cooling (lower surface temperature), the cooling efficiency, defined as h/0.5pv^2, is actually higher for lower driving pressure.
|Item Type:||Book Section|
|Additional Information:||© 1999 IEEE. Reprinted with Permission. Publication Date: 17-21 Jan. 1999. This work was sponsored by the Air Force Office of Scientific Research, USAF, under grant/contract number 49620-96-1-0376. The authors would like to thank Trevor Roper, Ronghua Zhang, Charles Grosjean, and Qiao Lin for their contribution to the work.|
|Subject Keywords:||arrays; cooling; heat exchangers; heat sinks; jets; microfluidics; microsensors; nozzles; temperature distribution; temperature sensors; thermal management (packaging); 2D surface temperature measurement; 500 micron; 70 to 33 C; MEMS impinging jets; MEMS sensor chip; Parylene layer; Si; chip cooling; cooling efficiency; driving pressure; heat transfer; integrated heater; jet arrays; micro heat exchanger; micro-cooling; microelectronics packages; nozzle arrays; nozzle diameter; nozzle spacing; polysilicon heater; single jet; slot arrays; temperature distribution; temperature-sensor array|
|Usage Policy:||No commercial reproduction, distribution, display or performance rights in this work are provided.|
|Deposited By:||Kristin Buxton|
|Deposited On:||06 May 2008|
|Last Modified:||26 Dec 2012 10:00|
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