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A suspended microchannel with integrated temperature sensors for high-pressure flow studies

Wu, S. and Mai, J. and Zohar, Y. and Tai, Y. C. and Ho, C. M. (1998) A suspended microchannel with integrated temperature sensors for high-pressure flow studies. In: International Workshop on Micro Electro Mechanical Systems, 11th. MEMS 98. IEEE , Piscataway, NJ, pp. 87-92. ISBN 0-7803-4412-X http://resolver.caltech.edu/CaltechAUTHORS:WUSmems98

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Abstract

A freestanding microchannel, with integrated temperature sensors, has been developed for high-pressure flow studies. These microchannels are approximately 20μm x 2μm x 4400μm, and are suspended above 80 μm deep cavities, bulk micromachined using BrF3 dry etch. The calibration of the lightly boron-doped thermistor-type sensors shows that the resistance sensitivity of these integrated sensors is parabolic with respect to temperature and linear with respect to pressure. Volumetric flow rates of N2 in the microchannel were measured at inlet pressures up to 578 psig. The discrepancy between the data and theory results from the flow acceleration in a channel, the non-parabolic velocity profile, and the bulging of the channel. Bulging effects were evaluated by using incompressible water flow measurements, which also measures 1.045x10^-3N-s/m^2 for the viscosity of DI water. The temperature data from sensors on the channel shows the heating of the channel due to the friction generated by the high-pressure flow inside.


Item Type:Book Section
Additional Information:© 1998 IEEE. Reprinted with Permission. Publication Date: 25-29 Jan. 1998. This work is sponsored by the Air Force Office of Scientific Research, USAF, under grant/contract number 49620-96-1-0376. The authors would like to thank Trevor Roper, Tom Tsao and Xuan-Qi Wang for the help with the process.
Subject Keywords:boron compounds; calibration; flow measurement; high-pressure techniques; microsensors; semiconductor technology; temperature measurement; temperature sensors; thermistors; 2 mum; 20 mum; 4400 mum; BrF3; BrF3 dry etch; N2; bulging; calibration; flow acceleration; free-standing microchannel; high-pressure flow; incompressible water flow measurement; integrated sensors; integrated temperature sensors; nonparabolic velocity profile; resistance sensitivity; suspended microchannel; temperature data; thermistor; volumetric flow rates
Record Number:CaltechAUTHORS:WUSmems98
Persistent URL:http://resolver.caltech.edu/CaltechAUTHORS:WUSmems98
Alternative URL:http://dx.doi.org/10.1109/MEMSYS.1998.659734
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:10446
Collection:CaltechAUTHORS
Deposited By: Kristin Buxton
Deposited On:06 May 2008
Last Modified:26 Dec 2012 10:00

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