Harris, J. M. and Lugujjo, E. and Campisano, S. U. and Nicolet, M-A. and Shima, R. (1975) Studies on the Al2O3–Ti–Mo–Au metallization system. Journal of Vacuum Science and Technology, 12 (1). pp. 524-527. ISSN 0022-5355. http://resolver.caltech.edu/CaltechAUTHORS:HARjvst75a
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The behavior of Ti–Mo–Au metallization on Al2O3 and C has been investigated by backscattering spectrometry. Results show that Mo–Au bimetal films typically mix during deposition. Diffusion of Ti in Mo film occurs at 600°C, but is inhibited by the presence of oxygen in the Ti film. Even 1000 Å of Mo is not a barrier against interdiffusion of Ti and Au during 20–min anneals at 600°C. The amount of mixing observed also depends on the nature of the substrate which supports the Ti–Mo–Au metallization.
|Additional Information:||© 1975 American Vacuum Society. (Received 19 August 1974; final form 27 September 1974) We would like to thank to express our grateful appreciation to Motorola, Scottsdale, Arizona, for their participation in this project.|
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|Deposited On:||23 Jun 2008|
|Last Modified:||26 Dec 2012 10:07|
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