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Published May 15, 1984 | Published
Journal Article Open

Electrical characteristics of amorphous molybdenum-nickel contacts to silicon

Abstract

The electrical characteristics of sputtered, amorphous Mo-Ni contacts have been measured on both p- and n-type Si, as functions of composition (30, 54, and 58 at. % Mo). The contact resistivity on both p+ and n+ Si is in the 10^−6 Ω cm^2 range. The barrier height for as-deposited samples varies between φbp=0.47–0.42 V on p-type Si and between φbn=0.63–0.68 V on n-type Si, as the composition of the amorphous layer goes from Ni-rich to Mo-rich. The sum φbp+φbn always equals 1.12 V, within experimental error. After thermal treatment at 500 °C for 1/2 h, the contact resistivity changes by a factor of two or less, while the barrier height changes by at most ~0.05 V. In light of these results, the amorphous Mo-Ni film makes good ohmic contacts to silicon.

Additional Information

© 1984 American Institute of Physics. Received 15 July 1983; accepted 30 January 1984. The authors are grateful to M. Finetti for assistance in using the photolithographic facilities and for constructive criticisms on the electrical measurements, B.X. Liu and T. Banwell for assistance in operating the x-ray diffractometer and the MeV van de Graaf accelerator, and R. Gorris for technical assistance. Access to the photolithography lab and to the x-ray diffraction facility were granted by Professor D. Rutledge and Professor T. Vreeland, Jr. This work was supported in part by the U.S. Department of Energy through an agreement with the National Aeronautics and Space Administration and monitored by the Jet Propulsion Laboratory, California Institute of Technology (D.B. Bickler and D.R. Burger).

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