Desai, A. and Lee, S. W. and Tai, Y. C. (1998) A MEMS electrostatic particle transportation system. In: International Workshop on Micro Electro Mechanical Systems, 11th (MEMS 98). Heidelberg, Germany, 25-29 January 1998. IEEE , Piscataway, NJ, pp. 121-126. ISBN 0-7803-4412-X http://resolver.caltech.edu/CaltechAUTHORS:DESmems98
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We demonstrate here an electrostatic MEMS system capable of transporting particles 5-10μm in diameter in air. This system consists of 3-phase electrode arrays covered by insulators (Figs. 1, 2). Extensive testing of this system has been done using a variety of insulation materials (silicon nitride, photoresist, and Teflon), thickness (0- 12μm), particle sizes (1-10μm), particle materials (metal, glass, polystyrene, spores, etc), waveforms, frequencies, and voltages. Although previous literature [1-2] claimed it impractical to electrostatically transport particles with sizes 5-10μm due to complex surface forces, this effort actually shows it feasible (as high as 90% efficiency) with the optimal combination of insulation thickness, electrode geometry, and insulation material. Moreover, we suggest a qualitative theory for our particle transportation system which is consistent with our data and finite-element electrostatic simulations.
|Item Type:||Book Section|
|Additional Information:||© Copyright 1998 IEEE. Reprinted with permission. Publication Date: 25-29 Jan. 1998. The funding for this project was provided by DARPA, MicroFlumes Contract. N66001-96-C-83632. The authors would also like to thank Mr. X.Q. Wang and Mr. W. Hsieh for their knowledge and assistance with parylene and Teflon films.|
|Subject Keywords:||electrostatic devices; finite element analysis; glass insulating coatings; microelectrodes; micromechanical devices; photoresists; polymer films; silicon compounds; transportation; 3-phase electrode arrays; MEMS electrostatic particle transportation; SiN; SiO2; Teflon; air; complex surface forces; electrode geometry; finite-element electrostatic simulation; glass; insulation materials; metal; particle materials; particle size; photoresist; polystyrene; spores; testing|
|Usage Policy:||No commercial reproduction, distribution, display or performance rights in this work are provided.|
|Deposited By:||Kristin Buxton|
|Deposited On:||11 Dec 2008 05:43|
|Last Modified:||26 Dec 2012 10:32|
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