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A MEMS electrostatic particle transportation system

Desai, A. and Lee, S. W. and Tai, Y. C. (1998) A MEMS electrostatic particle transportation system. In: International Workshop on Micro Electro Mechanical Systems, 11th (MEMS 98). Heidelberg, Germany, 25-29 January 1998. IEEE , Piscataway, NJ, pp. 121-126. ISBN 0-7803-4412-X

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We demonstrate here an electrostatic MEMS system capable of transporting particles 5-10μm in diameter in air. This system consists of 3-phase electrode arrays covered by insulators (Figs. 1, 2). Extensive testing of this system has been done using a variety of insulation materials (silicon nitride, photoresist, and Teflon), thickness (0- 12μm), particle sizes (1-10μm), particle materials (metal, glass, polystyrene, spores, etc), waveforms, frequencies, and voltages. Although previous literature [1-2] claimed it impractical to electrostatically transport particles with sizes 5-10μm due to complex surface forces, this effort actually shows it feasible (as high as 90% efficiency) with the optimal combination of insulation thickness, electrode geometry, and insulation material. Moreover, we suggest a qualitative theory for our particle transportation system which is consistent with our data and finite-element electrostatic simulations.

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Additional Information:© Copyright 1998 IEEE. Reprinted with permission. Publication Date: 25-29 Jan. 1998. The funding for this project was provided by DARPA, MicroFlumes Contract. N66001-96-C-83632. The authors would also like to thank Mr. X.Q. Wang and Mr. W. Hsieh for their knowledge and assistance with parylene and Teflon films.
Funding AgencyGrant Number
Defense Advanced Research Projects AgencyN66001-96-C-83632
Subject Keywords:electrostatic devices; finite element analysis; glass insulating coatings; microelectrodes; micromechanical devices; photoresists; polymer films; silicon compounds; transportation; 3-phase electrode arrays; MEMS electrostatic particle transportation; SiN; SiO2; Teflon; air; complex surface forces; electrode geometry; finite-element electrostatic simulation; glass; insulation materials; metal; particle materials; particle size; photoresist; polystyrene; spores; testing
Record Number:CaltechAUTHORS:DESmems98
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Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:12473
Deposited By: Kristin Buxton
Deposited On:11 Dec 2008 05:43
Last Modified:24 Apr 2015 16:21

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