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A micromachined flow shear-stress sensor based on thermal transfer principles

Liu, Chang and Huang, Jin-Biao and Zhu, Zhenjun (Alex) and Jiang, Fukang and Tung, Steve and Tai, Yu-Chong and Ho, Chih-Ming (1999) A micromachined flow shear-stress sensor based on thermal transfer principles. Journal of Microelectromechanical Systems, 8 (1). pp. 90-99. ISSN 1057-7157. http://resolver.caltech.edu/CaltechAUTHORS:CHAjms99

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Abstract

Microhot-film shear-stress sensors have been developed by using surface micromachining techniques. The sensor consists of a suspended silicon-nitride diaphragm located on top of a vacuum-sealed cavity. A heating and heat-sensing element, made of polycrystalline silicon material, resides on top of the diaphragm. The underlying vacuum cavity greatly reduces conductive heat loss to the substrate and therefore increases the sensitivity of the sensor. Testing of the sensor has been conducted in a wind tunnel under three operation modes-constant current, constant voltage, and constant temperature. Under the constant-temperature mode, a typical shear-stress sensor exhibits a time constant of 72 μs.


Item Type:Article
Additional Information:“©1998 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.” Manuscript received July 3, 1998; revised November 18, 1998. Subject Editor, G. Stemme.
Record Number:CaltechAUTHORS:CHAjms99
Persistent URL:http://resolver.caltech.edu/CaltechAUTHORS:CHAjms99
Alternative URL:http://dx.doi.org/10.1109/84.749408
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ID Code:1269
Collection:CaltechAUTHORS
Deposited By: Archive Administrator
Deposited On:06 Jan 2006
Last Modified:26 Dec 2012 08:43

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