Bai, G. and Nicolet, M.-A. (1991) Defects production and annealing in self-implanted Si. Journal of Applied Physics, 70 (2). pp. 649-655. ISSN 0021-8979. http://resolver.caltech.edu/CaltechAUTHORS:BAIjap91b
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230-keV 28Si ions were implantated into Si(100) at room temperature with doses from 1014 to 1015/cm2. The samples were analyzed by x-ray double crystal diffractometry and 2-MeV 4He ion channeling spectrometry. The implanted layer has a parallel lattice spacing equal to that of the unimplanted substrate. The perpendicular lattice spacing is larger than that of the unimplanted substrate and is proportional to the defect concentration extracted from the channeling measurement. Both the perpendicular lattice spacing and the defect concentration increase nonlinearly with ion dose. The defect concentration initially increases slowly with dose until a critical value (~15%, at 4×1014/cm2), then rises rapidly, and finally a continuous amorphous layer forms. The initial sluggish increase of the damage is due to the considerable recombination of point defects at room temperature. The rapid growth of the defect concentration is attributed to the reduction of the threshold energy for atomic displacement in a predamaged crystal. The amorphization is envisioned as a cooperative process initiated by a spontaneous collapse of heavily damaged crystalline regions. The annealing behavior of the damaged layer reveals various stages of defect recovery, indicating that the damage consists of a hierarchy of various defect structures of vacancy and interstitial aggregates.
|Additional Information:||Copyright © 1991 American Institute of Physics. (Received 12 February 1991; accepted for publication 4 April 1991) The authors thank Dr. T. Vreeland, Jr. for constructive comments, Dr. W. L. Johnson for helpful discussions, and Mr. C. J. Tsai for providing the rocking curve fitting program. This work is supported in part by the Semiconductor Research Corporation under Contract No. 100-SJ-89 and by the National Science Foundation under Grant No. DMR-8811795. The authors gratefully acknowledge this support.|
|Subject Keywords:||SILICON; ANNEALING; DEFECT STRUCTURE; ION IMPLANTATION|
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|Deposited By:||Archive Administrator|
|Deposited On:||17 Feb 2006|
|Last Modified:||26 Dec 2012 08:45|
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