Chen, Jian Z. and Troian, Sandra M. and Darhuber, Anton A. and Wagner, Sigurd (2005) Effect of contact angle hysteresis on thermocapillary droplet actuation. Journal of Applied Physics, 97 (1). Art. No. 014906. ISSN 0021-8979 http://resolver.caltech.edu/CaltechAUTHORS:CHEjap05
See Usage Policy.
Use this Persistent URL to link to this item: http://resolver.caltech.edu/CaltechAUTHORS:CHEjap05
Open microfluidic devices based on actuation techniques such as electrowetting, dielectrophoresis, or thermocapillary stresses require controlled motion of small liquid droplets on the surface of glass or silicon substrates. In this article we explore the physical mechanisms affecting thermocapillary migration of droplets generated by surface temperature gradients on the supporting substrate. Using a combination of experiment and modeling, we investigate the behavior of the threshold force required for droplet mobilization and the speed after depinning as a function of the droplet size, the applied thermal gradient and the liquid material parameters. The experimental results are well described by a hydrodynamic model based on earlier work by Ford and Nadim. The model describes the steady motion of a two-dimensional droplet driven by thermocapillary stresses including contact angle hysteresis. The results of this study highlight the critical role of chemical or mechanical hysteresis and the need to reduce this retentive force for minimizing power requirements in microfluidic devices.
|Additional Information:||©2005 American Institute of Physics (Received 31 March 2004; accepted 24 September 2004; published online 15 December 2004) The authors gratefully acknowledge financial support from the National Science Foundation (CTS and DMR), the NASA Microgravity Fluid Physics Program, and the U.S. Army TACOM-ARDEC. SMT kindly acknowledges the warm hospitality and generous support of the Moore Distinguished Scholar Program at Caltech, where final editorial changes were made.|
|Subject Keywords:||drops; contact angle; microfluidics; hydrodynamics; thermal conductivity; electromigration; capillarity|
|Usage Policy:||No commercial reproduction, distribution, display or performance rights in this work are provided.|
|Deposited By:||Archive Administrator|
|Deposited On:||23 Feb 2006|
|Last Modified:||26 Dec 2012 08:46|
Repository Staff Only: item control page