Huang, Cheng and Zhang, Q. M. and deBotton, Gal and Bhattacharya, Kaushik (2004) All-organic dielectric-percolative three-component composite materials with high electromechanical response. Applied Physics Letters, 84 (22). pp. 4391-4393. ISSN 0003-6951 http://resolver.caltech.edu/CaltechAUTHORS:HUAapl04a
See Usage Policy.
Use this Persistent URL to link to this item: http://resolver.caltech.edu/CaltechAUTHORS:HUAapl04a
By combining the high-dielectric copper phthalocyanine oligomer (PolyCuPc) and conductive polyanline (PANI) within polyurethane (PU) matrix an all-organic three-component dielectric-percolative composite with high dielectric constant is demonstrated. In this three-component composite system, the high-dielectric-constant PolyCuPc particulates enhance the dielectric constant of the PU matrix and this combined two-component dielectric matrix in turn serves as the high-dielectric-constant host for the PANI to realize percolative phenomenon and further enhance the dielectric response. As a result, an electromechanical strain of 9.3% and elastic energy density of 0.4 J/cm(3) under an electric field of 20 V/mum can be induced.
|Additional Information:||Copyright © 2004 American Institute of Physics. Received 8 January 2004; accepted 1 April 2004; published online 12 May 2004. The authors gratefully acknowledge the financial support of this work by NIH under Grant No. 8R01EB002078-04 and Chinese National Natural Science Foundation under Contract No. 50228304.|
|Subject Keywords:||polymer films; dielectric thin films; dielectric materials; conducting polymers; composite materials; percolation; internal stresses; Young's modulus; permittivity; dielectric losses; electromechanical effects|
|Usage Policy:||No commercial reproduction, distribution, display or performance rights in this work are provided.|
|Deposited By:||Tony Diaz|
|Deposited On:||28 Feb 2006|
|Last Modified:||26 Dec 2012 08:47|
Repository Staff Only: item control page