Huang, Cheng and Zhang, Q. M. and deBotton, Gal and Bhattacharya, Kaushik (2004) All-organic dielectric-percolative three-component composite materials with high electromechanical response. Applied Physics Letters, 84 (22). pp. 4391-4393. ISSN 0003-6951 http://resolver.caltech.edu/CaltechAUTHORS:HUAapl04a
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Abstract
By combining the high-dielectric copper phthalocyanine oligomer (PolyCuPc) and conductive polyanline (PANI) within polyurethane (PU) matrix an all-organic three-component dielectric-percolative composite with high dielectric constant is demonstrated. In this three-component composite system, the high-dielectric-constant PolyCuPc particulates enhance the dielectric constant of the PU matrix and this combined two-component dielectric matrix in turn serves as the high-dielectric-constant host for the PANI to realize percolative phenomenon and further enhance the dielectric response. As a result, an electromechanical strain of 9.3% and elastic energy density of 0.4 J/cm(3) under an electric field of 20 V/mum can be induced.
| Item Type: | Article |
|---|---|
| Additional Information: | Copyright © 2004 American Institute of Physics. Received 8 January 2004; accepted 1 April 2004; published online 12 May 2004. The authors gratefully acknowledge the financial support of this work by NIH under Grant No. 8R01EB002078-04 and Chinese National Natural Science Foundation under Contract No. 50228304. |
| Subject Keywords: | polymer films; dielectric thin films; dielectric materials; conducting polymers; composite materials; percolation; internal stresses; Young's modulus; permittivity; dielectric losses; electromechanical effects |
| Record Number: | CaltechAUTHORS:HUAapl04a |
| Persistent URL: | http://resolver.caltech.edu/CaltechAUTHORS:HUAapl04a |
| Alternative URL: | http://dx.doi.org/10.1063/1.1757632 |
| Usage Policy: | No commercial reproduction, distribution, display or performance rights in this work are provided. |
| ID Code: | 1986 |
| Collection: | CaltechAUTHORS |
| Deposited By: | Tony Diaz |
| Deposited On: | 28 Feb 2006 |
| Last Modified: | 26 Dec 2012 08:47 |
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