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All-organic dielectric-percolative three-component composite materials with high electromechanical response

Huang, Cheng and Zhang, Q. M. and deBotton, Gal and Bhattacharya, Kaushik (2004) All-organic dielectric-percolative three-component composite materials with high electromechanical response. Applied Physics Letters, 84 (22). pp. 4391-4393. ISSN 0003-6951. http://resolver.caltech.edu/CaltechAUTHORS:HUAapl04a

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Abstract

By combining the high-dielectric copper phthalocyanine oligomer (PolyCuPc) and conductive polyanline (PANI) within polyurethane (PU) matrix an all-organic three-component dielectric-percolative composite with high dielectric constant is demonstrated. In this three-component composite system, the high-dielectric-constant PolyCuPc particulates enhance the dielectric constant of the PU matrix and this combined two-component dielectric matrix in turn serves as the high-dielectric-constant host for the PANI to realize percolative phenomenon and further enhance the dielectric response. As a result, an electromechanical strain of 9.3% and elastic energy density of 0.4 J/cm(3) under an electric field of 20 V/mum can be induced.


Item Type:Article
Additional Information:Copyright © 2004 American Institute of Physics. Received 8 January 2004; accepted 1 April 2004; published online 12 May 2004. The authors gratefully acknowledge the financial support of this work by NIH under Grant No. 8R01EB002078-04 and Chinese National Natural Science Foundation under Contract No. 50228304.
Subject Keywords:polymer films; dielectric thin films; dielectric materials; conducting polymers; composite materials; percolation; internal stresses; Young's modulus; permittivity; dielectric losses; electromechanical effects
Record Number:CaltechAUTHORS:HUAapl04a
Persistent URL:http://resolver.caltech.edu/CaltechAUTHORS:HUAapl04a
Alternative URL:http://dx.doi.org/10.1063/1.1757632
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:1986
Collection:CaltechAUTHORS
Deposited By: Tony Diaz
Deposited On:28 Feb 2006
Last Modified:26 Dec 2012 08:47

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