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Scalable flexible chip-level parylene package for high lead count retinal prostheses

Rodger, Damien C. and Weiland, James D. and Humayun, Mark S. and Tai, Yu-Chong (2005) Scalable flexible chip-level parylene package for high lead count retinal prostheses. In: Transducers '05 : 13th International Conference on Solid-State Sensors, Actuators, and Microsystems. IEEE , Piscataway, NJ, pp. 1973-1976. ISBN 0-7803-8994-8 http://resolver.caltech.edu/CaltechAUTHORS:20110825-150721909

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Abstract

We present an innovative technology for the fabrication of a biocompatible parylene-based high lead count retinal prosthesis in which a prefabricated stand-alone application-specific integrated circuit (ASIC) is placed directly into the fabrication process of the other system components. The package is fabricated in such a way that the ASIC-to-electrode interconnects are patterned using standard photolithography. The density of interconnects is fully scalable to the limits of lithography. This packaging scheme also enables the simultaneous integration and interconnection of discrete components such as chip capacitors with the rest of the system. Electrical test results verify the efficacy of this cost-effective and high-yield packaging scheme, and pave the way for a monolithic implantable parylene-based intraocular system.


Item Type:Book Section
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URLURL TypeDescription
http://dx.doi.org/10.1109/SENSOR.2005.1497487DOIUNSPECIFIED
http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=1497487&tag=1PublisherUNSPECIFIED
Additional Information:© 2005 IEEE. Issue Date: 5-9 June 2005; Date of Current Version: 22 August 2005. The authors would like to thank Dr. Dilek Guven for her work on the parylene implantation study and Dr. Wentai Liu for providing the model MOSIS-fabricated ASICs. We would also like to thank Mr. Trevor Roper and other members of the Caltech Micromachining Laboratory for assistance with equipment and fabrication. This work was supported in part by the Engineering Research Centers Program of the National Science Foundation under Award Number EEC-0310723 and by a fellowship from the Whitaker Foundation (D.R.).
Funders:
Funding AgencyGrant Number
NSF Engineering Research Centers ProgramEEC-0310723
Whitaker FoundationUNSPECIFIED
Subject Keywords:BioMEMS; Neural prosthesis; Packaging; Parylene; Retinal prosthesis
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INSPEC Accession Number8660098
Record Number:CaltechAUTHORS:20110825-150721909
Persistent URL:http://resolver.caltech.edu/CaltechAUTHORS:20110825-150721909
Official Citation:Rodger, D.C.; Weiland, J.D.; Humayun, M.S.; Yu-Chong Tai; , "Scalable flexible chip-level parylene package for high lead count retinal prostheses," Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on , vol.2, no., pp. 1973- 1976 Vol. 2, 5-9 June 2005 doi: 10.1109/SENSOR.2005.1497487
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:25105
Collection:CaltechAUTHORS
Deposited By: Jason Perez
Deposited On:25 Aug 2011 23:00
Last Modified:25 Aug 2011 23:00

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