Shih, Victor Chi-Yuan and Harder, Theodore A. and Tai, Yu-Chong (2003) Yield strength of thin-film parylene-C. In: DTIP 2003: Design, test, integration and packaging of MEMS/MOEMS. IEEE , Piscataway, N.J., pp. 394-398. ISBN 0-7803-7066-X http://resolver.caltech.edu/CaltechAUTHORS:20111026-074002939
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For the first time, the yield strength of thin-film parylene-c is measured from membrane load-deflection experiments and surface profile analysis. To do so, the onset pressure which causes plastic deformation of the membrane is first experimentally measured. Then a new 2-step displacement model, together with the energy minimization technique, is developed to convert the onset pressure to the yield strength on the pre-stressed parylene membrane under a uniform pressure loading. The results depict a Yield Strength of 59 MPa (or 0.012 of strain) for thin-film parylene-c in comparison to 55 MPa reported by parylene vendor (measured from large samples). To double check with the result, the balloon model is further used to compare with the stress value from our model at the center of parylene membranes and good agreements are obtained.
|Item Type:||Book Section|
|Additional Information:||© 2003 IEEE. Date of Current Version: 19 April 2004. This work is supported by the NSF Center for Neuromorphic Systems Engineering (CNSE) at Caltech.|
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|Official Citation:||Victor Chi-Yuan Shih; Harder, T.A.; Yu-Chong Tai; , "Yield strength of thin-film parylene-c," Design, Test, Integration and Packaging of MEMS/MOEMS 2003. Symposium on , vol., no., pp. 394- 398, 5-7 May 2003 doi: 10.1109/DTIP.2003.1287075 URL: http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=1287075&isnumber=28693|
|Usage Policy:||No commercial reproduction, distribution, display or performance rights in this work are provided.|
|Deposited By:||Ruth Sustaita|
|Deposited On:||26 Oct 2011 15:00|
|Last Modified:||26 Oct 2011 15:00|
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