Huang, Jin-Biao and Ho, Chih-Ming (1995) Polysilicon structures for shear stress sensors. In: 1995 IEEE TENCON: IEEE Region 10 International Conference on Microelectronics and VLSI. IEEE Hong Kong Section , Hong Kong, pp. 12-15. ISBN 0-7803-2624-5 http://resolver.caltech.edu/CaltechAUTHORS:20120215-160303462
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Four types of micromachined polysilicon structures have been designed and fabricated for wall shear stress sensors in flow measurement and control. Their frequency responses, heat transfer characteristics and windtunnel responses have been extensively studied. They are all useful but one may be better than the others depending on the application requirement.
|Item Type:||Book Section|
|Additional Information:||© 1995 IEEE. Issue Date: 6-10 Nov 1995; Date of Current Version: 06 August 2002. This project is sponsored by the Air Force of Scientific Research, Air Force Material Command, USAF, under the grant number F49620-1-93-0332. The authors would like to thank Mr. Trevor Roper for the help with processing and Dr. Steve Tung for the help with wind-tunnel testing.|
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|Official Citation:||Fukang Jiang; Yu-Chong Tai; Jin-Biao Huang; Chih-Ming Ho; , "Polysilicon structures for shear stress sensors," Microelectronics and VLSI, 1995. TENCON '95., IEEE Region 10 International Conference on , vol., no., pp.12-15, 6-10 Nov 1995 doi: 10.1109/TENCON.1995.496323|
|Usage Policy:||No commercial reproduction, distribution, display or performance rights in this work are provided.|
|Deposited By:||Jason Perez|
|Deposited On:||16 Feb 2012 18:33|
|Last Modified:||16 Feb 2012 18:33|
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