Hwang, Gyeong S. and Giapis, Konstantinos P. (1997) The Role of the Substrate on Pattern-Dependent Charging. Journal of the Electrochemical Society, 144 (12). L320-L322. ISSN 0013-4651 http://resolver.caltech.edu/CaltechAUTHORS:HWAjes97b
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Monte Carlo simulations of charging and profile evolution during plasma etching reveal that the substrate can mediate current imbalance across the wafer. This function couples patterned areas, where the electron shading effect dominates, to substrate areas directly exposed to the plasma. When a net positive current flows through the pattern features to the substrate, increasing the exposed area decreases the substrate potential, thereby causing notching at the connected feature sidewalls to worsen, in agreement with experimental observations.
|Additional Information:||©1997 The Electrochemical Society, Inc. Manuscript received Aug. 25, 1997. This work was supported by an NSF-Career Award and a Camille Dreyfus Teacher-Scholar Award to K.P.G. An Applied Materials Scholarship in partial support of G.S.H. is gratefully acknowledged. California Institute of Technology assisted in meeting the publication costs of this article.|
|Subject Keywords:||Monte Carlo methods; plasma applications; etching; wafer-scale integration; tunnelling|
|Usage Policy:||No commercial reproduction, distribution, display or performance rights in this work are provided.|
|Deposited By:||Archive Administrator|
|Deposited On:||10 May 2006|
|Last Modified:||26 Dec 2012 08:52|
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