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The Polygon Package

Sutherland, Ivan (1978) The Polygon Package. California Institute of Technology , Pasadena, CA. (Unpublished) http://resolver.caltech.edu/CaltechAUTHORS:20120418-103150565

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Abstract

The memoranda listed below describe the polygon package it its present state. For easy reference, these memoranda have been packaged together.


Item Type:Report or Paper (Technical Report)
Additional Information:Silicon Structures Project sponsored by Burroughs Corporation, Digital Equipment Corporation, Hewlett Packard Company, Honeywell Incorporated, International Business Machines Corporation, Intel Corporation, Xerox Corporation, and the National Science Foundation
Group:Computer Science Technical Reports
Funders:
Funding AgencyGrant Number
Burroughs CorporationUNSPECIFIED
Digital Equipment CorporationUNSPECIFIED
Hewlett Packard CompanyUNSPECIFIED
Honeywell IncorporatedUNSPECIFIED
International Business Machines CorporationUNSPECIFIED
Intel CorporationUNSPECIFIED
Xerox CorporationUNSPECIFIED
NSFUNSPECIFIED
Other Numbering System:
Other Numbering System NameOther Numbering System ID
Computer Science Technical Reports1438
Record Number:CaltechAUTHORS:20120418-103150565
Persistent URL:http://resolver.caltech.edu/CaltechAUTHORS:20120418-103150565
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:30160
Collection:CaltechCSTR
Deposited By: Kristin Buxton
Deposited On:18 Apr 2012 17:54
Last Modified:26 Dec 2012 15:04

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