Sutherland, Ivan (1978) The Polygon Package. California Institute of Technology , Pasadena, CA. (Unpublished) http://resolver.caltech.edu/CaltechAUTHORS:20120418-103150565
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Abstract
The memoranda listed below describe the polygon package it its present state. For easy reference, these memoranda have been packaged together.
| Item Type: | Report or Paper (Technical Report) | ||||||||||||||||||
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| Additional Information: | Silicon Structures Project sponsored by Burroughs Corporation, Digital Equipment Corporation, Hewlett Packard Company, Honeywell Incorporated, International Business Machines Corporation, Intel Corporation, Xerox Corporation, and the National Science Foundation | ||||||||||||||||||
| Group: | Computer Science Technical Reports | ||||||||||||||||||
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| Record Number: | CaltechAUTHORS:20120418-103150565 | ||||||||||||||||||
| Persistent URL: | http://resolver.caltech.edu/CaltechAUTHORS:20120418-103150565 | ||||||||||||||||||
| Usage Policy: | No commercial reproduction, distribution, display or performance rights in this work are provided. | ||||||||||||||||||
| ID Code: | 30160 | ||||||||||||||||||
| Collection: | CaltechCSTR | ||||||||||||||||||
| Deposited By: | Kristin Buxton | ||||||||||||||||||
| Deposited On: | 18 Apr 2012 17:54 | ||||||||||||||||||
| Last Modified: | 26 Dec 2012 15:04 |
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