Sun, Y. -K. and Vajo, J. J. and Chan, C. -Y. and Weinberg, W. H. (1988) Kinetics and mechanism of formic acid decomposition on Ru(001). Journal of Vacuum Science and Technology A, 6 (3). pp. 854-855. ISSN 0734-2101 http://resolver.caltech.edu/CaltechAUTHORS:20120621-104259088
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The steady-state rate of decomposition of formic acid on Ru(001) has been measured as a function of surface temperature, parametric in the pressure of formic acid. The products of the decomposition reaction are C0_2, H_2, CO, and H_2)0, i.e., both dehydrogenation and dehydration occur on Ru (001). A similar product distribution has been observed on Ni(110), Ni(100), Ru(100), Fe(100), and Ni(111) surfaces; whereas only dehydrogenation to C0_2 and H_2 occurs on the Cu(100), Cu(110), and Pt(111) surfaces. Only reversible adsorption and desorption of formic acid is observed on the less reactive Ag(110) surface at low temperatures, whereas the more reactive Mo(100) surface is oxidized by formic acid at low temperatures with the products of this reaction being H_2, CO, and H_(2)O (Ref. 10). We report here the confirmation of earlier observations of the occurrence of both dehydrogenation and dehydration of formic acid on Ru(001), and more importantly, we provide a detailed mechanistic description of the steady-state decomposition reaction on this surface in terms of elementary steps.
|Additional Information:||© 1988 American Vacuum Society. Received 7 December 1987; accepted 13 January 1988. This work was supported by the National Science Foundation under Grant No. DMR-8500789.|
|Classification Code:||PACS: 82.65.+r; 82.30.Lp|
|Official Citation:||Summary Abstract: Kinetics and mechanism of formic acid decomposition on Ru(001) Y.-K. Sun, J. J. Vajo, C.-Y. Chan, and W. H. Weinberg, J. Vac. Sci. Technol. A 6, 854 (1988), DOI:10.1116/1.575092|
|Usage Policy:||No commercial reproduction, distribution, display or performance rights in this work are provided.|
|Deposited By:||Jason Perez|
|Deposited On:||22 Jun 2012 16:53|
|Last Modified:||26 Dec 2012 15:21|
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