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The influence of mask thickness on charging damage during overetching

Hwang, Gyeong S. and Giapis, Konstantinos P. (1997) The influence of mask thickness on charging damage during overetching. Journal of Applied Physics, 82 (2). pp. 572-577. ISSN 0021-8979.

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Feature-scale charging simulations during gate electrode overetching in high-density plasmas reveal that the thickness of the insulating mask plays a critical role in charging damage. When thinner masks are used, the electron irradiance of the conductive part of the sidewalls increases, causing the charging potentials of the polysilicon lines to decrease, thus reducing the probability for catastrophic tunneling currents through the underlying oxide. Simultaneously, changes in the charging potential distribution at the bottom SiO2 surface cause a significant perturbation in the local ion dynamics which, in turn, adversely affects notching. Notches are predicted to form everywhere in a line-and-space structure, even when the lines are electrically isolated. The results suggest that the trend toward thinner (hard) masks—to keep the aspect ratio low as device dimensions shrink—should reduce oxide failure but at the cost of more severe notching.

Item Type:Article
Additional Information:©1997 American Institute of Physics. (Received 24 January 1997; accepted 16 April 1997) This material was based on work supported by an NSF Career Award to K.P.G. (CTS-9623450).
Subject Keywords:masks; sputter etching; silicon; elemental semiconductors; surface potential
Record Number:CaltechAUTHORS:HWAjap97a
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Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:4800
Deposited By: Archive Administrator
Deposited On:07 Sep 2006
Last Modified:26 Dec 2012 09:01

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