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Solidification Processing of Te–Sb–Pb Alloys For Thermoelectric Applications

Ikeda, Teruyuki and Azizgolshani, Hesham and Haile, Sossina and Snyder, G. Jeffrey and Ravi, Vilupanur (2005) Solidification Processing of Te–Sb–Pb Alloys For Thermoelectric Applications. In: ICT: 2005 24th International Conference on Thermoelectrics. IEEE , Piscataway, NJ, pp. 132-135. ISBN 0-7803-9552-2 http://resolver.caltech.edu/CaltechAUTHORS:IKEict05

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Abstract

A solidification processing approach to the refinement of lead-tellurium-antimony alloy microstructure is described. Liquid alloys with eutectic, hyper-eutectic and hypo-eutectic compositions (relative to lead) were cooled to the solid state in three distinct ways, i.e. by water quenching, air cooling and furnace cooling. The structures of the alloys resulting from the three different solidification paths were examined using electron microscopy and the micrographs were quantified. Classical solidification methods were used to interpret the structures in relation to the cooling histories.


Item Type:Book Section
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http://dx.doi.org/10.1109/ICT.2005.1519906 DOIUNSPECIFIED
http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=1519906&tag=1PublisherUNSPECIFIED
Additional Information:© 2005 IEEE. Reprinted with permission. Posted online: 2005-10-24. T.I. is supported by NSF through Caltech’s Center for the Science and Engineering of Materials (CSEM). Portions of this work were carried out at the Jet Propulsion Laboratory/California Institute of Technology; H.A. is supported by the JPLUS program at JPL/Caltech. We gratefully acknowledge the assistance of Dr. Chi Ma of Caltech for assistance with electron microscope image acquisition.
Funders:
Funding AgencyGrant Number
NSF Caltech Center for the Science and Engineering of Materials (CSEM)UNSPECIFIED
JPL/Caltech JPLUS ProgramUNSPECIFIED
Subject Keywords:tellurium-antimony-lead; solidification; dendrite structure; secondary dendrite arm spacing; lamella structure
Record Number:CaltechAUTHORS:IKEict05
Persistent URL:http://resolver.caltech.edu/CaltechAUTHORS:IKEict05
Alternative URL:http://dx.doi.org/10.1109/ICT.2005.1519906
Official Citation:T. Ikeda, H. Azizgolshani, S. M. Haile, G. J. Snyder and V. A Ravi "Solidification Processing of Te–Sb–Pb Alloys For Thermoelectric Applications" 24th International Conference on Thermoelectrics. Proceedings, ICT'05 p.132 (IEEE, Clemson, SC, USA, 2005)
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:9456
Collection:CaltechAUTHORS
Deposited By: Jeff Snyder
Deposited On:07 Jan 2008
Last Modified:03 Dec 2013 23:30

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