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Li, Wen and Rodger, Damien C. and Meng, Ellis et al. (2010) Wafer-Level Parylene Packaging With Integrated RF Electronics for Wireless Retinal Prostheses. Journal of Microelectromechanical Systems, 19 (4). pp. 735-742. ISSN 1057-7157. http://resolver.caltech.edu/CaltechAUTHORS:20101118-134541510

This list was generated on Thu Apr 27 04:07:47 2017 PDT.