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Rodger, Damien C. and Weiland, James D. and Humayun, Mark S. et al. (2005) Scalable flexible chip-level parylene package for high lead count retinal prostheses. In: Transducers '05 : 13th International Conference on Solid-State Sensors, Actuators, and Microsystems. IEEE , Piscataway, NJ, pp. 1973-1976. ISBN 0-7803-8994-8 http://resolver.caltech.edu/CaltechAUTHORS:20110825-150721909

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