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Kolawa, E. and Chen, J. S. and Reid, J. S. et al. (1991) Tantalum-based diffusion barriers in Si/Cu VLSI metallizations. Journal of Applied Physics, 70 (3). pp. 1369-1373. ISSN 0021-8979. http://resolver.caltech.edu/CaltechAUTHORS:KOLjap91

This list was generated on Sun Mar 26 00:10:18 2017 PDT.