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High copper content bulk glass formation in bimetallic Cu-Hf system

Duan, Gang and Xu, Donghua and Johnson, William L. (2005) High copper content bulk glass formation in bimetallic Cu-Hf system. Metallurgical and Material Transactions A, 36 (2). pp. 455-458. ISSN 1073-5623. doi:10.1007/s11661-005-0316-8.

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We report in this article that strip-shaped amorphous samples with thicknesses from 0.5 to 2 mm were successfully synthesized for binary Cu-Hf alloys containing 60 to 68 at. pct Cu by the traditional copper mold casting method. The best glass former Cu₆₆Hf₃₄ with casting thickness up to 2 mm has an undercooled liquid region (ΔT=T_x –T_g , where T_g is the glass transition temperature and T_x is the onset temperature of the first crystallization event) of 51 K, which is somewhat narrow compared with other neighboring alloys in the same system. The bulk glassy Cu₆₆Hf₃₄ alloy exhibits Vicker’s Hardness (H_v ) ∼779 kg/mm², Young’s modulus ∼108 GPa, fracture strength ∼2.1 GPa, and an almost constant elastic elongation ∼1.8 pct upon compression. The discovery of Cu₆₆Hf₃₄ as a bulk glass confirms the existence of rather simple bulk-glass-forming metallic systems. Moreover, the present Cu-Hf alloys may be the highest copper content bulk metallic glasses reported to date, to the best of our knowledge.

Item Type:Article
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Xu, Donghua0000-0001-5018-5603
Additional Information:© 2005 Springer. Received 25 March 2004. The authors thank the Defense Advanced Research Projects Agency (DARPA), Defense Sciences Office, for support under ARO Grant No. DAAD19-01-0525. Carol Garland is also acknowledged for her help with the TEM analysis.
Funding AgencyGrant Number
Defense Advanced Research Projects Agency (DARPA)UNSPECIFIED
Army Research Office (ARO)DAAD19-01-0525
Subject Keywords:Material Transaction; Differential Scanning Calorimeter; Bulk Metallic Glass; Glassy Alloy; Cast Strip
Issue or Number:2
Record Number:CaltechAUTHORS:20200221-092741191
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Official Citation:Duan, G., Xu, D. & Johnson, W.L. High copper content bulk glass formation in bimetallic Cu-Hf system. Metall and Mat Trans A 36, 455–458 (2005).
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:101451
Deposited By: Tony Diaz
Deposited On:21 Feb 2020 18:05
Last Modified:16 Nov 2021 18:02

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