Townley, Andrew and Baniasadi, Nima and Krishnamurthy, Sashank and Sideris, Constantine and Hajimiri, Ali and Alon, Elad and Niknejad, Ali (2020) A Fully Integrated, Dual Channel, Flip Chip Packaged 113 GHz Transceiver in 28nm CMOS supporting an 80 Gb/s Wireless Link. In: 2020 IEEE Custom Integrated Circuits Conference (CICC). IEEE , Piscataway, NJ, pp. 1-4. ISBN 9781728160313. https://resolver.caltech.edu/CaltechAUTHORS:20200430-152742107
Full text is not posted in this repository. Consult Related URLs below.
Use this Persistent URL to link to this item: https://resolver.caltech.edu/CaltechAUTHORS:20200430-152742107
Abstract
In order to meet the demand for increasingly higher data rate wireless links, broad-bandwidth transceivers that support high-spectral-efficiency modulation schemes are required. In this paper, a mm-wave transceiver IC operating at 113GHz is demonstrated, achieving a single-channel data rate of 80Gb/s. The transceiver achieves a high level of integration, including LO generation circuitry, a bits-to-RF TX DAC, and two transceiver channels for polarization diversity. The chip is flip-chip packaged onto a PCB with two orthogonally polarized antennas.
Item Type: | Book Section | ||||||
---|---|---|---|---|---|---|---|
Related URLs: |
| ||||||
ORCID: |
| ||||||
Additional Information: | © 2020 IEEE. This work was supported in part by the ComSenTer research center, under the JUMP program, a Semiconductor Research Corporation program sponsored by DARPA. The authors would also like to acknowledge TSMC for chip fabrication, Integrand Software for EMX electromagnetic simulation. Many thanks to Cyril Luxey and Diane Titz of University of Nice Sophia Antipolis for many helpful discussions regarding the antenna design. Finally, the authors would like to thank the BWRC sponsors, students, and staff. | ||||||
Funders: |
| ||||||
DOI: | 10.1109/cicc48029.2020.9075890 | ||||||
Record Number: | CaltechAUTHORS:20200430-152742107 | ||||||
Persistent URL: | https://resolver.caltech.edu/CaltechAUTHORS:20200430-152742107 | ||||||
Official Citation: | A. Townley et al., "A Fully Integrated, Dual Channel, Flip Chip Packaged 113 GHz Transceiver in 28nm CMOS supporting an 80 Gb/s Wireless Link," 2020 IEEE Custom Integrated Circuits Conference (CICC), Boston, MA, USA, 2020, pp. 1-4. | ||||||
Usage Policy: | No commercial reproduction, distribution, display or performance rights in this work are provided. | ||||||
ID Code: | 102953 | ||||||
Collection: | CaltechAUTHORS | ||||||
Deposited By: | George Porter | ||||||
Deposited On: | 01 May 2020 14:59 | ||||||
Last Modified: | 16 Nov 2021 18:17 |
Repository Staff Only: item control page