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Thermal Analysis of a Skull Implant in Brain-Computer Interfaces

Serrano-Amenos, Claudia and Hu, Frank and Wang, Po T. and Kellis, Spencer and Andersen, Richard A. and Liu, Charles Y. and Heydari, Payam and Do, An H. and Nenadic, Zoran (2020) Thermal Analysis of a Skull Implant in Brain-Computer Interfaces. In: 2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC). IEEE , Piscataway, NJ, pp. 3066-3069. ISBN 9781728119908. https://resolver.caltech.edu/CaltechAUTHORS:20200914-142034847

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Abstract

The goal of this study is to estimate the thermal impact of a titanium skull unit (SU) implanted on the exterior aspect of the human skull. We envision this unit to house the front-end of a fully implantable electrocorticogram (ECoG)-based bi-directional (BD) brain-computer interface (BCI). Starting from the bio-heat transfer equation with physiologically and anatomically constrained tissue parameters, we used the finite element method (FEM) implemented in COMSOL to build a computational model of the SU’s thermal impact. Based on our simulations, we predicted that the SU could consume up to 75 mW of power without raising the temperature of surrounding tissues above the safe limits (increase in temperature of 1°C). This power budget by far exceeds the power consumption of our front-end prototypes, suggesting that this design can sustain the SU’s ability to record ECoG signals and deliver cortical stimulation. These predictions will be used to further refine the existing SU design and inform the design of future SU prototypes.


Item Type:Book Section
Related URLs:
URLURL TypeDescription
https://doi.org/10.1109/embc44109.2020.9175483DOIArticle
ORCID:
AuthorORCID
Kellis, Spencer0000-0002-5158-1058
Andersen, Richard A.0000-0002-7947-0472
Additional Information:© 2020 IEEE. Work supported by the National Science Foundation (Award #1646275).
Funders:
Funding AgencyGrant Number
NSFCNS-1646275
Record Number:CaltechAUTHORS:20200914-142034847
Persistent URL:https://resolver.caltech.edu/CaltechAUTHORS:20200914-142034847
Official Citation:C. Serrano-Amenos et al., "Thermal Analysis of a Skull Implant in Brain-Computer Interfaces," 2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Montreal, QC, Canada, 2020, pp. 3066-3069, doi: 10.1109/EMBC44109.2020.9175483
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:105383
Collection:CaltechAUTHORS
Deposited By: Tony Diaz
Deposited On:14 Sep 2020 21:28
Last Modified:14 Sep 2020 21:28

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