Single-Step Direct Growth of Graphene on Cu Ink toward Flexible Hybrid Electronic Applications by Plasma-Enhanced Chemical Vapor Deposition
- Creators
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Lu, Chen-Hsuan
- Leu, Chyi-Ming
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Yeh, Nai-Chang
Abstract
Highly customized and free-formed products in flexible hybrid electronics (FHE) require direct pattern creation such as inkjet printing (IJP) to accelerate product development. In this work, we demonstrate the direct growth of graphene on Cu ink deposited on polyimide (PI) by means of plasma-enhanced chemical vapor deposition (PECVD), which provides simultaneous reduction, sintering, and passivation of the Cu ink and further reduces its resistivity. We investigate the PECVD growth conditions for optimizing the graphene quality on Cu ink and find that the defect characteristics of graphene are sensitive to the H₂/CH₄ ratio at higher total gas pressure during the growth. The morphology of Cu ink after the PECVD process and the dependence of the graphene quality on the H₂/CH₄ ratio may be attributed to the difference in the corresponding electron temperature. Therefore, this study paves a new pathway toward efficient growth of high-quality graphene on Cu ink for applications in flexible electronics and Internet of Things (IoT).
Additional Information
© 2021 The Authors. Published by American Chemical Society. Received: December 15, 2020; Accepted: January 19, 2021; Published: February 1, 2021. The authors acknowledge MMRC at Caltech for providing access to the AFM and Professor George Rossman for providing access to the Raman spectrometer. CHL thanks Wei-Hsiang Lin for helpful discussion on the Raman spectroscopic characterizations of graphene. The authors acknowledge MCL at ITRI for assisting the acquisition of HAADF–STEM images and XPS measurements and Chih-Cheng Lin for his assistance at ITRI. Author Contributions: The project was conceived jointly by C.-M.L. and N.-C.Y., and C.-H.L. carried out the PECVD graphene growth, Raman spectroscopic studies, SEM imaging, XPS analysis, and AFM measurements. N.-C.Y. coordinated and supervised the research activities at Caltech. C.-M.L. coordinated the research activities at ITRI and the collaboration with Caltech. All authors contributed to the writing of the manuscript and have given approval to the final version of the manuscript. The project was funded by the Industrial Technology Research Institute (ITRI) in Taiwan with award number NCY.PECVD-1-ITRI.SRA2020. The authors declare no competing financial interest.Attached Files
Supplemental Material - am0c22207_si_001.pdf
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Additional details
- Eprint ID
- 107885
- Resolver ID
- CaltechAUTHORS:20210203-071421044
- Industrial Technology Research Institute
- NCY.PECVD-1-ITRI.SRA2020
- Created
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2021-02-03Created from EPrint's datestamp field
- Updated
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2023-02-28Created from EPrint's last_modified field