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Studies on the Al2O3–Ti–Mo–Au metallization system

Harris, J. M. and Lugujjo, E. and Campisano, S. U. and Nicolet, M-A. and Shima, R. (1975) Studies on the Al2O3–Ti–Mo–Au metallization system. Journal of Vacuum Science and Technology, 12 (1). pp. 524-527. ISSN 0022-5355. doi:10.1116/1.568580.

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The behavior of Ti–Mo–Au metallization on Al2O3 and C has been investigated by backscattering spectrometry. Results show that Mo–Au bimetal films typically mix during deposition. Diffusion of Ti in Mo film occurs at 600°C, but is inhibited by the presence of oxygen in the Ti film. Even 1000 Å of Mo is not a barrier against interdiffusion of Ti and Au during 20–min anneals at 600°C. The amount of mixing observed also depends on the nature of the substrate which supports the Ti–Mo–Au metallization.

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Additional Information:© 1975 American Vacuum Society. (Received 19 August 1974; final form 27 September 1974) We would like to thank to express our grateful appreciation to Motorola, Scottsdale, Arizona, for their participation in this project.
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Record Number:CaltechAUTHORS:HARjvst75a
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Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:11023
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Deposited On:23 Jun 2008
Last Modified:08 Nov 2021 21:13

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