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Oxidation-resistant metallic films: Surface engineering at the angstrom scale

Wang, Haozhe and Minnich, Austin J. (2022) Oxidation-resistant metallic films: Surface engineering at the angstrom scale. Matter, 5 (8). pp. 2455-2457. ISSN 2590-2385. doi:10.1016/j.matt.2022.05.045. https://resolver.caltech.edu/CaltechAUTHORS:20220805-204421000

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Abstract

Oxidation-resistant metallic films are of fundamental and practical interest in diverse applications, such as classical and quantum electronics. In a recent paper in Nature, Kim et al. report Cu (111) surfaces which do not oxidize over year timescales owing to their atomic flatness with predominantly mono-atomic steps. This finding highlights how novel functionality of future devices may be achieved through manufacturing with precision at the atomic scale.


Item Type:Article
Related URLs:
URLURL TypeDescription
https://doi.org/10.1016/j.matt.2022.05.045DOIArticle
ORCID:
AuthorORCID
Wang, Haozhe0000-0001-5123-1077
Minnich, Austin J.0000-0002-9671-9540
Additional Information:© 2022 Elsevier. Available online 5 August 2022, Version of Record 5 August 2022.
Issue or Number:8
DOI:10.1016/j.matt.2022.05.045
Record Number:CaltechAUTHORS:20220805-204421000
Persistent URL:https://resolver.caltech.edu/CaltechAUTHORS:20220805-204421000
Official Citation:Haozhe Wang, Austin J. Minnich, Oxidation-resistant metallic films: Surface engineering at the angstrom scale, Matter, Volume 5, Issue 8, 2022, Pages 2455-2457, ISSN 2590-2385, https://doi.org/10.1016/j.matt.2022.05.045.
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:116150
Collection:CaltechAUTHORS
Deposited By: George Porter
Deposited On:09 Aug 2022 17:21
Last Modified:09 Aug 2022 17:21

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