Wang, Haozhe and Minnich, Austin J. (2022) Oxidation-resistant metallic films: Surface engineering at the angstrom scale. Matter, 5 (8). pp. 2455-2457. ISSN 2590-2385. doi:10.1016/j.matt.2022.05.045. https://resolver.caltech.edu/CaltechAUTHORS:20220805-204421000
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Abstract
Oxidation-resistant metallic films are of fundamental and practical interest in diverse applications, such as classical and quantum electronics. In a recent paper in Nature, Kim et al. report Cu (111) surfaces which do not oxidize over year timescales owing to their atomic flatness with predominantly mono-atomic steps. This finding highlights how novel functionality of future devices may be achieved through manufacturing with precision at the atomic scale.
Item Type: | Article | ||||||
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Additional Information: | © 2022 Elsevier. Available online 5 August 2022, Version of Record 5 August 2022. | ||||||
Issue or Number: | 8 | ||||||
DOI: | 10.1016/j.matt.2022.05.045 | ||||||
Record Number: | CaltechAUTHORS:20220805-204421000 | ||||||
Persistent URL: | https://resolver.caltech.edu/CaltechAUTHORS:20220805-204421000 | ||||||
Official Citation: | Haozhe Wang, Austin J. Minnich, Oxidation-resistant metallic films: Surface engineering at the angstrom scale, Matter, Volume 5, Issue 8, 2022, Pages 2455-2457, ISSN 2590-2385, https://doi.org/10.1016/j.matt.2022.05.045. | ||||||
Usage Policy: | No commercial reproduction, distribution, display or performance rights in this work are provided. | ||||||
ID Code: | 116150 | ||||||
Collection: | CaltechAUTHORS | ||||||
Deposited By: | George Porter | ||||||
Deposited On: | 09 Aug 2022 17:21 | ||||||
Last Modified: | 09 Aug 2022 17:21 |
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