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Novel thermoplastic bonding using a bulk metallic glass solder

Suh, Jin-Yoo and Lohwongwatana, Boonrat and Garland, Carol M. and Conner, R. Dale and Johnson, William L. and Suh, Daewoong (2008) Novel thermoplastic bonding using a bulk metallic glass solder. Scripta Materialia, 59 (8). pp. 905-908. ISSN 1359-6462.

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A novel thermoplastic bonding concept is demonstrated based on the unique rheological behavior and pattern-replicating ability of bulk metallic glass (BMG)-forming liquids. In this approach, the BMG is heated above Tg to the “supercooled liquid” region while a small normal force is applied to the joint. This results in liquid reflow, wetting and a strong bond. Complete wetting between copper substrates and a layer of platinum-based BMG leads to an atomistically intimate void-free interface.

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Additional Information:Copyright © 2008 Acta Materialia Inc. Received 10 June 2008; revised 24 June 2008; accepted 25 June 2008. Available online 10 July 2008. The authors acknowledge the support from the INTEL Corporation under award No. 27940. This work benefited from use of the Caltech KNI and Mat Sci TEM facilities supported by the MRSEC Program of the National Science Foundation under Award Number DMR-0520565.
Group:Kavli Nanoscience Institute
Funding AgencyGrant Number
Intel Corp.27940
Kavli Nanoscience Institute, CaltechUNSPECIFIED
National Science FoundationDMR-0520565
Subject Keywords:Metallic glasses; Supercooled liquid; Bonding; Joining; Soldering
Issue or Number:8
Record Number:CaltechAUTHORS:SUHsm08
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Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:12163
Deposited By: Archive Administrator
Deposited On:27 Oct 2008 23:26
Last Modified:03 Oct 2019 00:26

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