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IC-integrated flexible shear-stress sensor skin

Xu, Yong and Tai, Yu-Chong and Huang, Adam and Ho, Chih-Ming (2003) IC-integrated flexible shear-stress sensor skin. Journal of Microelectromechanical Systems, 12 (5). pp. 740-747. ISSN 1057-7157. doi:10.1109/JMEMS.2003.815831.

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This paper reports the successful development of the first IC-integrated flexible MEMS shear-stress sensor skin. The sensor skin is 1 cm wide, 2 cm long, and 70 /spl mu/m thick. It contains 16 shear-stress sensors, which are arranged in a 1-D array, with on-skin sensor bias, signal-conditioning, and multiplexing circuitry. We further demonstrated the application of the sensor skin by packaging it on a semicylindrical aluminum block and testing it in a subsonic wind tunnel. In our experiment, the sensor skin has successfully identified both the leading-edge flow separation and stagnation points with the on-skin circuitry. The integration of IC with MEMS sensor skin has significantly simplified implementation procedures and improved system reliability.

Item Type:Article
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Tai, Yu-Chong0000-0001-8529-106X
Additional Information:“© 2003 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.” Manuscript received July 17, 2002; revised April 7, 2003. Posted online: 2003-10-27. This work was supported by DARPA under the Navy Contract N66001-97-C-8610 and by the NSF Center for Neuromorphic System Engineering at Caltech. This paper is based upon a 2002 Hilton Head presentation. Subject Editor K. D. Wise. The authors would like to acknowledge the help from J. Boland, S. Walker Boland, M. Lige, J. Xie, Z. Han, and T. Roper.
Funding AgencyGrant Number
Defense Advanced Research Projects Agency (DARPA)UNSPECIFIED
Office of Naval Research (ONR)N66001-97-C-8610
Center for Neuromorphic Systems Engineering, CaltechUNSPECIFIED
Subject Keywords:Flexible skin, MEMS-IC integration, shear-stress sensors
Issue or Number:5
Record Number:CaltechAUTHORS:XUYjms03
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Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:1271
Deposited By: Archive Administrator
Deposited On:06 Jan 2006
Last Modified:08 Nov 2021 19:08

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