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Development of tough, low-density titanium-based bulk metallic glass matrix composites with tensile ductility

Hofmann, Douglas C. and Suh, Jin-Yoo and Wiest, Aaron and Lind, Mary Laura and Demetriou, Marios D. and Johnson, William L. (2008) Development of tough, low-density titanium-based bulk metallic glass matrix composites with tensile ductility. Proceedings of the National Academy of Sciences of the United States of America, 105 (51). pp. 20136-20140. ISSN 0027-8424.

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The mechanical properties of bulk metallic glasses (BMGs) and their composites have been under intense investigation for many years, owing to their unique combination of high strength and elastic limit. However, because of their highly localized deformation mechanism, BMGs are typically considered to be brittle materials and are not suitable for structural applications. Recently, highly-toughened BMG composites have been created in a Zr–Ti-based system with mechanical properties comparable with high-performance crystalline alloys. In this work, we present a series of low-density, Ti-based BMG composites with combinations of high strength, tensile ductility, and excellent fracture toughness.

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Additional Information:© 2008 by The National Academy of Sciences of the USA. Edited by J. C. Phillips, Rutgers University, Piscataway, NJ, and approved November 11, 2008 (received for review September 10, 2008). This article is a PNAS Direct Submission. Published online before print December 11, 2008, doi: 10.1073/pnas.0809000106 We thank C.E. Hofmann for insightful discussions. This work was supported by the U.S. Office of Naval Research. D.C.H. was supported by the U.S. Department of Defense through the National Defense Science and Engineering Graduate fellowship program. Author contributions: D.C.H. and W.L.J. designed research; D.C.H., J.-Y.S., A.W., and M.-L.L. performed research; D.C.H., J.-Y.S., M.D.D., and W.L.J. analyzed data; and D.C.H. and W.L.J. wrote the paper. The authors declare no conflict of interest.
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Office of Naval ResearchUNSPECIFIED
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Issue or Number:51
Record Number:CaltechAUTHORS:HOFpnas08
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ID Code:13018
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Deposited On:15 Jan 2009 20:26
Last Modified:03 Oct 2019 00:33

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