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Thermal conductivity of thermally-isolating polymeric and composite structural support materials between 0.3 and 4 K

Runyan, M. C. and Jones, W. C. (2008) Thermal conductivity of thermally-isolating polymeric and composite structural support materials between 0.3 and 4 K. Cryogenics, 48 (9-10). pp. 448-454. ISSN 0011-2275. doi:10.1016/j.cryogenics.2008.06.002. https://resolver.caltech.edu/CaltechAUTHORS:RUNcryo08

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Abstract

We present measurements of the low-temperature thermal conductivity of a number of polymeric and composite materials from 0.3 to 4 K. The materials measured are Vespel SP-1, Vespel SP-22, unfilled PEEK, 30% carbon fiber-filled PEEK, 30% glass-filled PEEK, carbon fiber Graphlite composite rod, Torlon 4301, G-10/FR-4 fiberglass, pultruded fiberglass composite, Macor ceramic, and graphite rod. These materials have moderate to high elastic moduli making them useful for thermally-isolating structural supports.


Item Type:Article
Related URLs:
URLURL TypeDescription
http://dx.doi.org/10.1016/j.cryogenics.2008.06.002DOIUNSPECIFIED
Additional Information:© 2008 Elsevier Ltd. Received 24 May 2008. Received in revised form 10 June 2008. Accepted 11 June 2008. This work was supported under the SPIDER project by NASA Grant No. NNX07AL64G. The authors wish to thank Justin Lazear for his assistance with thermometer cross-calibration, Mike Zemcov for pointing us to Poco Graphite, and Warren Holmes for useful discussions.
Funders:
Funding AgencyGrant Number
NASANNX07AL64G
Subject Keywords:thermal conductivity; polymers; composites; structural materials
Issue or Number:9-10
DOI:10.1016/j.cryogenics.2008.06.002
Record Number:CaltechAUTHORS:RUNcryo08
Persistent URL:https://resolver.caltech.edu/CaltechAUTHORS:RUNcryo08
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:13585
Collection:CaltechAUTHORS
Deposited By: Tony Diaz
Deposited On:11 May 2009 20:51
Last Modified:08 Nov 2021 22:39

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