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Integrated parylene-cabled silicon probes for neural prosthetics

Huang, R. and Pang, C. and Tai, Y. C. and Emken, J. and Ustun, C. and Andersen, R. and Burdick, J. (2008) Integrated parylene-cabled silicon probes for neural prosthetics. In: MEMS 2008 Tucson : 21st IEEE International Conference on Micro Electro Mechanical Systems : Tucson, Arizona, USA, January 13-17, 2008 : technical digest. Proceedings: IEEE Micro Electro Mechanical Systems. IEEE , Piscataway, NJ, pp. 240-243. ISBN 978-1-4244-1792-6. https://resolver.caltech.edu/CaltechAUTHORS:20100708-083634152

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Abstract

Recent advances in the field of neural prosthetics have demonstrated the thought control of a computer cursor. This capability relies primarily on electrode array surgically implanted into the brain as an acquisition source of neural activity. Various technologies have been developed for signal extraction; however most suffer from either fragile electrode shanks and bulky cables or inefficient use of surgical site areas. Here we present a design and initial testing results from high electrode density, silicon based arrays system with an integrated parylene cable. The greatly reduced flexible rigidity of the parylene cable is believed to relief possible mechanical damages due to relative motion between a brain and its skull.


Item Type:Book Section
Related URLs:
URLURL TypeDescription
http://dx.doi.org/10.1109/MEMSYS.2008.4443637 DOIArticle
ORCID:
AuthorORCID
Tai, Y. C.0000-0001-8529-106X
Andersen, R.0000-0002-7947-0472
Additional Information:© 2008 IEEE. This work is supported by Defense Advanced Research Projects Agency (DARPA) (Award # 908165) and by National Institute of Health (NIH) moveable probe project (Award # R01EY015545). The authors also would like to thank Mr. Trevor Roper, Agnes Tong, other members of the Caltech Micromachining Laboratory and members of the Andersen lab at Caltech for their advice and help.
Funders:
Funding AgencyGrant Number
Defense Advanced Research Projects Agency (DARPA)908165
NIHR01EY015545
Series Name:Proceedings: IEEE Micro Electro Mechanical Systems
DOI:10.1109/MEMSYS.2008.4443637
Record Number:CaltechAUTHORS:20100708-083634152
Persistent URL:https://resolver.caltech.edu/CaltechAUTHORS:20100708-083634152
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:18943
Collection:CaltechAUTHORS
Deposited By: Tony Diaz
Deposited On:09 Jul 2010 17:18
Last Modified:08 Nov 2021 23:48

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