Li, W. and Rodger, D. C. and Tai, Y. C. (2008) Implantable RF-coiled chip packaging. In: MEMS 2008 Tucson : 21st IEEE International Conference on Micro Electro Mechanical Systems. Proceedings: IEEE Micro Electro Mechanical Systems. IEEE , Piscataway, NJ, pp. 108-111. ISBN 978-1-4244-1792-6. https://resolver.caltech.edu/CaltechAUTHORS:20100715-142417092
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Abstract
In this paper, we present an embedded chip integration technology that utilizes silicon housings and flexible parylene radio frequency (RF) coils. As a demonstration of this technology, a flexible parylene RF coil has been integrated with an RF identification (RFID) chip. The coil has an inductance of 16 μH, with two layers of metal completely encapsulated in parylene-C. The functionality of the embedded chip is verified using an RFID reader module. Accelerated-lifetime soak testing has been performed in saline, and the results show that the silicon chip is well protected and the lifetime of our parylene-encapsulated RF coil at 37 °C is more than 20 years.
Item Type: | Book Section | ||||||
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Additional Information: | © 2008 IEEE. This work is supported in part by the Engineering Research Center Program of the National Science Foundation under Award Number EEC-0310723 and by a fellowship from the Whitaker Foundation (D.R.). The authors would also like to thank Mr. Trevor Roper and other members of the Caltech Micromachining Laboratory for assistance with fabrication. | ||||||
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Series Name: | Proceedings: IEEE Micro Electro Mechanical Systems | ||||||
DOI: | 10.1109/MEMSYS.2008.4443604 | ||||||
Record Number: | CaltechAUTHORS:20100715-142417092 | ||||||
Persistent URL: | https://resolver.caltech.edu/CaltechAUTHORS:20100715-142417092 | ||||||
Usage Policy: | No commercial reproduction, distribution, display or performance rights in this work are provided. | ||||||
ID Code: | 19089 | ||||||
Collection: | CaltechAUTHORS | ||||||
Deposited By: | Tony Diaz | ||||||
Deposited On: | 06 Aug 2010 21:39 | ||||||
Last Modified: | 08 Nov 2021 23:49 |
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