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Implantable RF-coiled chip packaging

Li, W. and Rodger, D. C. and Tai, Y. C. (2008) Implantable RF-coiled chip packaging. In: MEMS 2008 Tucson : 21st IEEE International Conference on Micro Electro Mechanical Systems. Proceedings: IEEE Micro Electro Mechanical Systems. IEEE , Piscataway, NJ, pp. 108-111. ISBN 978-1-4244-1792-6.

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In this paper, we present an embedded chip integration technology that utilizes silicon housings and flexible parylene radio frequency (RF) coils. As a demonstration of this technology, a flexible parylene RF coil has been integrated with an RF identification (RFID) chip. The coil has an inductance of 16 μH, with two layers of metal completely encapsulated in parylene-C. The functionality of the embedded chip is verified using an RFID reader module. Accelerated-lifetime soak testing has been performed in saline, and the results show that the silicon chip is well protected and the lifetime of our parylene-encapsulated RF coil at 37 °C is more than 20 years.

Item Type:Book Section
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URLURL TypeDescription DOIArticle
Rodger, D. C.0000-0002-1583-5946
Tai, Y. C.0000-0001-8529-106X
Additional Information:© 2008 IEEE. This work is supported in part by the Engineering Research Center Program of the National Science Foundation under Award Number EEC-0310723 and by a fellowship from the Whitaker Foundation (D.R.). The authors would also like to thank Mr. Trevor Roper and other members of the Caltech Micromachining Laboratory for assistance with fabrication.
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Whitaker FoundationUNSPECIFIED
Series Name:Proceedings: IEEE Micro Electro Mechanical Systems
Record Number:CaltechAUTHORS:20100715-142417092
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Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:19089
Deposited By: Tony Diaz
Deposited On:06 Aug 2010 21:39
Last Modified:08 Nov 2021 23:49

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