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Modular microfluidic interconnects using photodefinable silicone microgaskets and MEMS O-rings

Miserendino, Scott and Tai, Yu-Chong (2008) Modular microfluidic interconnects using photodefinable silicone microgaskets and MEMS O-rings. Sensors and Actuators A, 143 (1). pp. 7-13. ISSN 0924-4247. doi:10.1016/j.sna.2007.07.019.

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Fully-integrated microgaskets and MEMS o-rings made of SU8 and photosensitive silicone are described and tested under varying conditions of compressive stress. An analytical theory of microgasket sealing behavior is also presented. The theory shows the critical importance of device surface flatness. The microgasket is found to be capable of deforming approximately 25% of its initial thickness and forming leakfree fluidic seals at inlet pressures below 50 psi. The microgasket is incorporated into a modular microfluidic system that exhibits system leak rates lower than 2.3 nL/min for working pressures up to 250 psi. The microgaskets and O-rings prove reusable under practical operating conditions. Fabricated chip-to-chip interconnects exhibit a low dead volume of approximately 9 nL while further optimization reduced the dead volume per interconnect to about 1 nL.

Item Type:Article
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Tai, Yu-Chong0000-0001-8529-106X
Additional Information:© 2007 Elsevier B.V. Received 19 March 2007; revised 18 July 2007; accepted 19 July 2007. Available online 24 July 2007. This work was supported by the Center for Cell Mimetic Space Exploration (CMISE), a NASA University Research, Engineering and Technology Institute (URETI), under award number #NCC 2-1364.
Funding AgencyGrant Number
NASANCC 2-1364
Subject Keywords:Microgaskets; Modular microfluidics; Silicone; Interconnects; Packaging
Issue or Number:1
Record Number:CaltechAUTHORS:20100721-104135346
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Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:19138
Deposited By: Jason Perez
Deposited On:21 Jul 2010 18:34
Last Modified:08 Nov 2021 23:50

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