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Implantable parylene-based wireless intraocular pressure sensor

Chen, Po-Jui and Rodger, Damien C. and Saati, Saloomeh and Humayun, Mark S. and Tai, Yu-Chong (2008) Implantable parylene-based wireless intraocular pressure sensor. In: MEMS 2008 Tucson : 21st IEEE International Conference on Micro Electro Mechanical Systems. Proceedings: IEEE Micro Electro Mechanical Systems. IEEE , Piscataway, NJ, pp. 58-61. ISBN 978-1-4244-1792-6. https://resolver.caltech.edu/CaltechAUTHORS:20100722-110448277

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Abstract

This paper presents a novel implantable, wireless, passive pressure sensor for ophthalmic applications. Two sensor designs incorporating surface-micromachined variable capacitor and variable capacitor/inductor are implemented to realize the pressure sensitive components. The sensor is monolithically microfabricated using parylene as a biocompatible structural material in a suitable form factor for increased ease of intraocular implantation. Pressure responses of the microsensor are characterized on-chip to demonstrate its high pressure sensitivity (> 7000 ppm/mmHg) with mmHg level resolution. An in vivo animal study verifies the biostability of the sensor implant in the intraocular environment after more than 150 days. This sensor will ultimately be implanted at the pars plana or iris of the eye to fulfill continuous intraocular pressure (IOP) monitoring in glaucoma patients.


Item Type:Book Section
Related URLs:
URLURL TypeDescription
http://dx.doi.org/10.1109/MEMSYS.2008.4443592 DOIArticle
http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=4443592PublisherArticle
ORCID:
AuthorORCID
Rodger, Damien C.0000-0002-1583-5946
Humayun, Mark S.0000-0002-5830-5208
Tai, Yu-Chong0000-0001-8529-106X
Additional Information:© 2008 IEEE. This work was supported in part by the Engineering Research Centers Program of the National Science Foundation (Award Number EEC-0310723) and part by Bausch and Lomb. The authors especially thank Dr. Rajat Agrawal and Dr. Rohit Varma for their valuable comments on surgical procedures, and Mr. Trevor Roper for his fabrication assistance.
Funders:
Funding AgencyGrant Number
NSFEEC-0310723
Bausch and LombUNSPECIFIED
Series Name:Proceedings: IEEE Micro Electro Mechanical Systems
Record Number:CaltechAUTHORS:20100722-110448277
Persistent URL:https://resolver.caltech.edu/CaltechAUTHORS:20100722-110448277
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:19163
Collection:CaltechAUTHORS
Deposited By: Tony Diaz
Deposited On:30 Jul 2010 17:51
Last Modified:09 Mar 2020 13:19

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