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Photodefinable silicone MEMS gaskets and O-rings for microfluidics packaging

Miserendino, Scott and Tai, Yu-Chong (2007) Photodefinable silicone MEMS gaskets and O-rings for microfluidics packaging. In: IEEE 20th International Conference on Micro Electro Mechanical Systems. IEEE , Piscataway, NJ, pp. 369-372. ISBN 978-1-4244-095-5.

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Fully-integrated MEMS gaskets and O-rings made of SU8 and photosensitive silicone are described and tested under varying conditions of compressive stress. An analytical theory of microgasket sealing behavior is also presented. The theory shows the critical importance of device surface flatness. The microgasket is found to be capable of deforming approximately 25% of its initial thickness and forming leak-free fluidic seals at inlet pressures below 50 psi. The microgasket is incorporated into a modular microfluidic system that exhibits system leak rates lower than 2.3 nL/min for working pressures up to 250 psi. Fabricated chip-to-chip interconnects exhibit a low dead volume of approximately 9 nL while further optimization can reduce dead volume per interconnect to about 1 nL.

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Tai, Yu-Chong0000-0001-8529-106X
Additional Information:© 2007 IEEE. Issue Date: 21-25 Jan. 2007; Date of Current Version: 21 January 2008. This work was supported by the Center for Cell Mimetic Space Exploration (CMISE), a NASA University Research, Engineering and Technology Institute (URETI), under award number #NCC 2-1364.
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NASANCC 2-1364
Record Number:CaltechAUTHORS:20100924-103516136
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Official Citation:Miserendino, S.; Yu-Chong Tai; , "Photodefinable silicone MEMS gaskets and O-rings for microfluidics packaging," Micro Electro Mechanical Systems, 2007. MEMS. IEEE 20th International Conference on , vol., no., pp.369-372, 21-25 Jan. 2007 doi: 10.1109/MEMSYS.2007.4433144 URL:
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:20123
Deposited By: Jason Perez
Deposited On:24 Sep 2010 19:59
Last Modified:03 Oct 2019 02:06

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