CaltechAUTHORS
  A Caltech Library Service

A Comparison of X-Ray Microdiffraction and Coherent Gradient Sensing in Measuring Discontinuous Curvatures in Thin Film: Substrate Systems

Brown, Michal A. and Park, Tae-Soon and Rosakis, A. J. and Üstündag, Ersan and Huang, Young and Tamura, Nobumichi and Valek, Bryan (2006) A Comparison of X-Ray Microdiffraction and Coherent Gradient Sensing in Measuring Discontinuous Curvatures in Thin Film: Substrate Systems. Journal of Applied Mechanics, 73 (5). pp. 723-729. ISSN 0021-8936. http://resolver.caltech.edu/CaltechAUTHORS:20110128-152248446

[img]
Preview
PDF - Published Version
See Usage Policy.

889Kb

Use this Persistent URL to link to this item: http://resolver.caltech.edu/CaltechAUTHORS:20110128-152248446

Abstract

The coherent gradient sensor (CGS) is a shearing interferometer which has been proposed for the rapid, full-field measurement of deformation states (slopes and curvatures) in thin film-wafer substrate systems, and for the subsequent inference of stresses in the thin films. This approach needs to be verified using a more well-established but time-consuming grain orientation and stress measurement tool, X-ray microdiffraction (XRD). Both CGS and XRD are used to measure the deformation state of the same W film/Si wafer at room temperature. CGS provides a global, wafer-level measurement of slopes while XRD provides a local micromeasurement of lattice rotations. An extreme case of a circular Si wafer with a circular W film island in its center is used because of the presence of discontinuous system curvatures across the wafer. The results are also compared with a theoretical model based on elastic plate analysis of the axisymmetric biomaterial film-substrate system. Slope and curvature measurements by XRD and by CGS compare very well with each other and with theory. The favorable comparison demonstrates that wafer-level CGS metrology provides a quick and accurate alternative to other measurements. It also demonstrates the accuracy of plate theory in modeling thin film-substrate systems, even in the presence of curvature discontinuities.


Item Type:Article
Related URLs:
URLURL TypeDescription
http://dx.doi.org/10.1115/1.2150500 DOIArticle
Additional Information:© 2006 ASME. Contributed by the Applied Mechanics Division of ASME for publication in the Journal of Applied Mechanics. Manuscript received March 18, 2005; final manuscript received October 14, 2005. Review conducted by K. M. Liechti. The Advanced Light Source is supported by the Director, Office of Science, Office of Basic Energy Sciences, Materials Sciences Division of the U.S. Department of Energy under Contract No. DE-AC03-76SF0098 at Lawrence Berkeley National Laboratory.
Group:GALCIT
Funders:
Funding AgencyGrant Number
Department of Energy (DOE)DE-AC03-76SF0098
Subject Keywords:tungsten, discontinuous metallic thin films, X-ray diffraction, curvature measurement, deformation, stress measurement, microsensors
Classification Code:PACS: 06.30.Bp; 81.70.Bt; 07.07.Df; 81.40.Lm; 62.20.Fe
Record Number:CaltechAUTHORS:20110128-152248446
Persistent URL:http://resolver.caltech.edu/CaltechAUTHORS:20110128-152248446
Official Citation:A Comparison of X-Ray Microdiffraction and Coherent Gradient Sensing in Measuring Discontinuous Curvatures in Thin Film: Substrate Systems Michal A. Brown, Tae-Soon Park, Ares Rosakis, Ersan Ustundag, Young Huang, Nobumichi Tamura, and Bryan Valek, J. Appl. Mech. 73, 723 (2006), DOI:10.1115/1.2150500
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:21924
Collection:CaltechAUTHORS
Deposited By: Tony Diaz
Deposited On:09 Feb 2011 23:53
Last Modified:09 Nov 2016 22:34

Repository Staff Only: item control page