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Mechanical Characterization of Released Thin Films by Contact Loading

Zhang, Rongjing and Shilo, Doron and Ravichandran, Guruswami and Bhattacharya, Kaushik (2006) Mechanical Characterization of Released Thin Films by Contact Loading. Journal of Applied Mechanics, 73 (5). pp. 730-736. ISSN 0021-8936. http://resolver.caltech.edu/CaltechAUTHORS:20110411-103722979

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Abstract

The design of reliable micro electro-mechanical systems (MEMS) requires understanding of material properties of devices, especially for free-standing thin structures such as membranes, bridges, and cantilevers. The desired characterization system for obtaining mechanical properties of active materials often requires load control. However, there is no such device among the currently available tools for mechanical characterization of thin films. In this paper, a new technique, which is load-controlled and especially suitable for testing highly fragile free-standing structures, is presented. The instrument developed for this purpose has the capability of measuring both the static and dynamic mechanical response and can be used for electro/magneto/thermo mechanical characterization of actuators or active materials. The capabilities of the technique are demonstrated by studying the behavior of 75 nm thick amorphous silicon nitride (Si_3N_4) membranes. Loading up to very large deflections shows excellent repeatability and complete elastic behavior without significant cracking or mechanical damage. These results indicate the stability of the developed instrument and its ability to avoid local or temporal stress concentration during the entire experimental process. Finite element simulations are used to extract the material properties such as Young's modulus and residual stress of the membranes. These values for Si_3N_4 are in close agreement with values obtained using a different technique, as well as those found in the literature. Potential applications of this technique in studying functional thin film materials, such as shape memory alloys, are also discussed.


Item Type:Article
Related URLs:
URLURL TypeDescription
http://dx.doi.org/10.1115/1.2166652 DOIArticle
ORCID:
AuthorORCID
Bhattacharya, Kaushik0000-0003-2908-5469
Additional Information:© 2006 American Society of Mechanical Engineers. Received 5 July 2005; revised 16 November 2005. The research support provided by the Army Research Office through a MURI grant (No. DAAD19-01-1-0517) to the California Institute of Technology on Engineered Complexity in Ferroelectric Devices is gratefully acknowledged.
Group:GALCIT
Funders:
Funding AgencyGrant Number
Army Research Office (ARO)DAAD19-01-1-0517
Subject Keywords:silicon compounds, noncrystalline structure, micromechanical devices, finite element analysis, Young's modulus, internal stresses, mechanical contact, elasticity
Classification Code:PACS: 07.10.Cm; 81.40.Jj; 62.20.Dc; 68.60.Bs; 02.70.Dh
Record Number:CaltechAUTHORS:20110411-103722979
Persistent URL:http://resolver.caltech.edu/CaltechAUTHORS:20110411-103722979
Official Citation:Mechanical Characterization of Released Thin Films by Contact Loading Rongjing Zhang, Doron Shilo, Guruswami Ravichandran, and Kaushik Bhattacharya, J. Appl. Mech. 73, 730 (2006), DOI:10.1115/1.2166652
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:23270
Collection:CaltechAUTHORS
Deposited By: Ruth Sustaita
Deposited On:12 Apr 2011 15:08
Last Modified:29 Sep 2016 23:16

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