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Influence of lower current densities on the residual stress and structure of thick nickel electrodeposits

Pathak, Siddhartha and Guinard, Marion and Vernooij, Martine G. C. and Cousin, Barbara and Wang, Zhao and Michler, Johann and Philippe, Laetitia (2011) Influence of lower current densities on the residual stress and structure of thick nickel electrodeposits. Surface and Coatings Technology, 205 (12). pp. 3651-3657. ISSN 0257-8972. https://resolver.caltech.edu/CaltechAUTHORS:20110414-105314610

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Abstract

Thick Ni electrodeposits, with thicknesses ranging from 18 to 90 μm, have been produced from sulfamate baths using very low current densities (1.5–5 mA cm^(−2)). Increasing grain sizes, with a corresponding decrease in the hardness values, and more columnar grain morphologies were observed with increasing current densities in the deposits. The anisotropy in the mechanical properties of the deposits were found to correlate strongly with the deposit texture, where the change from a < 101> dominated orientation at 1.5 mA cm^(−2) to a < 001> orientation at the higher (5 mA cm^(−2)) current density led to a corresponding decrease in the indentation modulus values for the respective Ni films. The residual stress values measured in the deposits (75–136 MPa) were found to be comparable to literature values of deposits plated at higher current densities, which rules out any potential advantage from the use of such low current densities for producing lower residual stresses.


Item Type:Article
Related URLs:
URLURL TypeDescription
http://dx.doi.org/10.1016/j.surfcoat.2011.01.012DOIArticle
http://www.sciencedirect.com/science/article/B6TVV-51Y57FC-7/2/0e51a0aa9979aeefbbd3da050e72e23fPublisherArticle
Additional Information:© 2011 Elsevier B.V. Received 6 August 2010; Accepted in revised form 6 January 2011; Available online 14 January 2011. The authors acknowledge helpful discussions with Christoph Rudolf, Thomas Sigrist and Marin Pavlovic and "nancial support from the Swiss Commission for Technology and Innovation (contract number 10610.1).
Funders:
Funding AgencyGrant Number
Swiss Commission for Technology and Innovation10610.1
Subject Keywords:Nickel; Electrodeposition; Sulfamate bath; Texture; Anisotropy; Back-scattered electron diffraction (EBSD); Indentation
Issue or Number:12
Record Number:CaltechAUTHORS:20110414-105314610
Persistent URL:https://resolver.caltech.edu/CaltechAUTHORS:20110414-105314610
Official Citation:Siddhartha Pathak, Marion Guinard, Martine G.C. Vernooij, Barbara Cousin, Zhao Wang, Johann Michler, Laetitia Philippe, Influence of lower current densities on the residual stress and structure of thick nickel electrodeposits, Surface and Coatings Technology, Volume 205, Issue 12, 15 March 2011, Pages 3651-3657, ISSN 0257-8972, DOI: 10.1016/j.surfcoat.2011.01.012.
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:23337
Collection:CaltechAUTHORS
Deposited By: Jason Perez
Deposited On:14 Apr 2011 20:33
Last Modified:03 Oct 2019 02:45

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