Tai, Yu-Chong (2005) Parylene BioMEMS. In: 2005 IEEE International Conference on Robotics and Biomimetics. IEEE , Piscataway, NJ, pp. 26-29. ISBN 0-7803-9315-5. https://resolver.caltech.edu/CaltechAUTHORS:20110727-135150005
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Abstract
This paper describes parylene as an emerging bioMEMS material. Parylene has the unique feature of room-temperature, pinhole-free conformal CVD deposition. It is chemically inert and biocompatible. More interestingly, it is found that parylene thin film usually possesses a tensile intrinsic stress, controlled by the last thermal steps. These features allow free-standing parylene MEMS structures in many designs. Parylene MEMS is also a suitable technology for post-CMOS integration. As a result, multi-layer parylene MEMS technology has been developed, especially for bioMEMS applications. This paper also gives examples of integrated parylene microfluidics and HPLC on-a-chip.
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Additional Information: | © 2005 IEEE. Date of Current Version: 16 October 2006. The authors would like to thank various graduate students at Caltech for their contribution to produce the excellent results. We also like to thank many US funding agencies, including DARPA, AFOSR, NASA, NSF and NIH for their support of our research. | ||||||||||||
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DOI: | 10.1109/ROBIO.2005.246388 | ||||||||||||
Record Number: | CaltechAUTHORS:20110727-135150005 | ||||||||||||
Persistent URL: | https://resolver.caltech.edu/CaltechAUTHORS:20110727-135150005 | ||||||||||||
Official Citation: | Yu-Chong Tai; , "Parylene BioMEMS," Robotics and Biomimetics (ROBIO). 2005 IEEE International Conference on , vol., no., pp.xxxvii, 0-0 0 doi: 10.1109/ROBIO.2005.246388 URL: http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=1708583&isnumber=36063 | ||||||||||||
Usage Policy: | No commercial reproduction, distribution, display or performance rights in this work are provided. | ||||||||||||
ID Code: | 24572 | ||||||||||||
Collection: | CaltechAUTHORS | ||||||||||||
Deposited By: | Tony Diaz | ||||||||||||
Deposited On: | 28 Jul 2011 15:45 | ||||||||||||
Last Modified: | 09 Nov 2021 16:24 |
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