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Parylene BioMEMS

Tai, Yu-Chong (2005) Parylene BioMEMS. In: 2005 IEEE International Conference on Robotics and Biomimetics. IEEE , Piscataway, NJ, pp. 26-29. ISBN 0-7803-9315-5. https://resolver.caltech.edu/CaltechAUTHORS:20110727-135150005

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Abstract

This paper describes parylene as an emerging bioMEMS material. Parylene has the unique feature of room-temperature, pinhole-free conformal CVD deposition. It is chemically inert and biocompatible. More interestingly, it is found that parylene thin film usually possesses a tensile intrinsic stress, controlled by the last thermal steps. These features allow free-standing parylene MEMS structures in many designs. Parylene MEMS is also a suitable technology for post-CMOS integration. As a result, multi-layer parylene MEMS technology has been developed, especially for bioMEMS applications. This paper also gives examples of integrated parylene microfluidics and HPLC on-a-chip.


Item Type:Book Section
Related URLs:
URLURL TypeDescription
http://dx.doi.org/10.1109/ROBIO.2005.246388DOIArticle
http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=1708583PublisherArticle
ORCID:
AuthorORCID
Tai, Yu-Chong0000-0001-8529-106X
Additional Information:© 2005 IEEE. Date of Current Version: 16 October 2006. The authors would like to thank various graduate students at Caltech for their contribution to produce the excellent results. We also like to thank many US funding agencies, including DARPA, AFOSR, NASA, NSF and NIH for their support of our research.
Funders:
Funding AgencyGrant Number
Defense Advanced Research Projects Agency (DARPA)UNSPECIFIED
Air Force Office of Scientific Research (AFOSR)UNSPECIFIED
NASAUNSPECIFIED
NSFUNSPECIFIED
NIHUNSPECIFIED
DOI:10.1109/ROBIO.2005.246388
Record Number:CaltechAUTHORS:20110727-135150005
Persistent URL:https://resolver.caltech.edu/CaltechAUTHORS:20110727-135150005
Official Citation:Yu-Chong Tai; , "Parylene BioMEMS," Robotics and Biomimetics (ROBIO). 2005 IEEE International Conference on , vol., no., pp.xxxvii, 0-0 0 doi: 10.1109/ROBIO.2005.246388 URL: http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=1708583&isnumber=36063
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:24572
Collection:CaltechAUTHORS
Deposited By: Tony Diaz
Deposited On:28 Jul 2011 15:45
Last Modified:09 Nov 2021 16:24

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