A Caltech Library Service

Residual stress in thin-film parylene-C

Harder, Theodore A. and Yao, Tze-Jung and He, Qing and Shih, Chi-Yuan and Tai, Yu-Chong (2002) Residual stress in thin-film parylene-C. In: 15th IEEE International Conference on Micro Electro Mechanical Systems. Proceedings: IEEE Micro Electro Mechanical Systems Workshop. IEEE , Piscataway, NJ, pp. 435-438. ISBN 0-7803-7185-2 .

Full text is not posted in this repository. Consult Related URLs below.

Use this Persistent URL to link to this item:


This paper reports the influence of thermal annealing on the residual stress in parylene-c thin-films on silicon. Although recently others have used the diaphragm bulge testing method to measure the residual stress in parylene, this is the first extensive study of residual stress in parylene using the load-deflection method and rotating tip strain gages. This paper supports the hypothesis that stress is relaxed in parylene-c films at elevated temperatures (>100°C) and that thermal stress accounts for 90% of the residual stress in films that have undergone annealing at these elevated temperatures. It was found that this held true up to 180°C which is above the glass transition temperature of the material.

Item Type:Book Section
Related URLs:
URLURL TypeDescription
Tai, Yu-Chong0000-0001-8529-106X
Additional Information:© 2002 IEEE. Meeting Date: 20 Jan 2002-24 Jan 2002; Date of Current Version: 07 August 2002. This work is supported by the NSF Center for Neuromorphic Systems Engineering (CNSE) at Caltech.
Funding AgencyGrant Number
NSF Center for Neuromorphic Systems Engineering (CNSE)UNSPECIFIED
Other Numbering System:
Other Numbering System NameOther Numbering System ID
INSPEC Accession Number7327970
Record Number:CaltechAUTHORS:20111101-111718089
Persistent URL:
Official Citation:Harder, T.A.; Tze-Jung Yao; Qing He; Chi-Yuan Shih; Yu-Chong Tai; , "Residual stress in thin-film parylene-c," Micro Electro Mechanical Systems, 2002. The Fifteenth IEEE International Conference on , vol., no., pp.435-438, 2002 doi: 10.1109/MEMSYS.2002.984296
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:27557
Deposited By: Jason Perez
Deposited On:01 Nov 2011 19:58
Last Modified:10 May 2017 22:57

Repository Staff Only: item control page