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Combined thermoelastic stress analysis and digital image correlation with a single infrared camera

Silva, M. L. and Ravichandran, G. (2011) Combined thermoelastic stress analysis and digital image correlation with a single infrared camera. Journal of Strain Analysis for Engineering Design, 46 (8). pp. 783-793. ISSN 0309-3247. https://resolver.caltech.edu/CaltechAUTHORS:20111202-122006740

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Abstract

A novel methodology simultaneously combining thermoelastic stress analysis (TSA) and digital image correlation (DIC) with a single infrared camera is presented. DIC is an optical method to determine deformation by image tracking with strains determined via differentiation. TSA is a non-contact measurement technique that provides the full-field stress directly using measured temperature changes. The combination of the two techniques improves the resolution and accuracy of TSA results by correcting for sample motion and distortion during loading. Illustrative examples, including an aluminium alloy plate with an edge crack and a nylon plate with a hole under tension, demonstrate the combined method which simultaneously measures stress and displacement.


Item Type:Article
Related URLs:
URLURL TypeDescription
http://dx.doi.org/10.1177/0309324711418286DOIUNSPECIFIED
http://sdj.sagepub.com/content/46/8/783PublisherUNSPECIFIED
Additional Information:© 2011 The Authors. © 2011 Institution of Mechanical Engineers. Received April 30, 2011; Accepted July 7, 2011. Published online before print September 9, 2011. This work was supported by the US Department of Defense Multidisciplinary University Research Initiative programme at the California Institute of Technology on Mechanics and Mechanisms of Impulse Loading, Damage and Failure of Marine Structures and Materials through the Office of Naval J. Strain Analysis Vol. 46 Research (grant number N00014-06-1-0730) (Dr Y. D. S. Rajapakse, Program Manager).
Group:GALCIT
Funders:
Funding AgencyGrant Number
U. S. Department of Defense Multidisciplinary University Research Initiative programme at CaltechUNSPECIFIED
Office of Naval ResearchN00014-06-1-0730
Subject Keywords:thermoelastic stress analysis; digital image correlation; infrared; distortion correction
Issue or Number:8
Record Number:CaltechAUTHORS:20111202-122006740
Persistent URL:https://resolver.caltech.edu/CaltechAUTHORS:20111202-122006740
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:28283
Collection:CaltechAUTHORS
Deposited By: Jason Perez
Deposited On:05 Dec 2011 21:12
Last Modified:03 Oct 2019 03:30

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