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Fluidic shear-stress measurement using surface-micromachined sensors

Huang, Jin-Biao and Liu, Chang and Jiang, Fukang and Tung, Steve and Tai, Yu-Chong and Ho, Chih-Ming (1995) Fluidic shear-stress measurement using surface-micromachined sensors. In: 1995 IEEE TENCON: IEEE Region 10 International Conference on Microelectronics and VLSI. IEEE Hong Kong Section , Hong Kong, pp. 16-19. ISBN 0-7803-2624-5.

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A poly-silicon hot-film shear-stress sensor insulated by a vacuum-chamber underneath has been designed and fabricated by the surface micromachining technology. The sensor is operated at both constant current and constant temperature modes. The dynamic performance (including time constant and cut-off frequency) measurement, calibration, and temperature compensation of the sensor have been realized.

Item Type:Book Section
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Tai, Yu-Chong0000-0001-8529-106X
Additional Information:© 1995 IEEE. Date of Current Version: 06 August 2002. This work is supported by AFOSR URI project (University Research Initiative).
Funding AgencyGrant Number
Air Force Office of Scientific Research (AFOSR)UNSPECIFIED
Record Number:CaltechAUTHORS:20120217-075451649
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Official Citation:Jin-Biao Huang; Chang Liu; Fu-Kang Jiang; Tung, S.; Yu-Chong Tai; Chih-Ming Ho; , "Fluidic shear-stress measurement using surface-micromachined sensors," Microelectronics and VLSI, 1995. TENCON '95., IEEE Region 10 International Conference on , vol., no., pp.16-19, 6-10 Nov 1995 doi: 10.1109/TENCON.1995.496324 URL:
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:29348
Deposited By: Ruth Sustaita
Deposited On:17 Feb 2012 16:22
Last Modified:09 Nov 2021 17:06

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