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The Polygon Package

Sutherland, Ivan E. (1978) The Polygon Package. Computer Science Technical Reports, 1978.1438. California Institute of Technology , Pasadena, CA. (Unpublished) http://resolver.caltech.edu/CaltechAUTHORS:20120418-103150565

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Abstract

The memoranda listed below describe the polygon package in its present state. For easy reference, these memoranda have been packaged together. Some of the material included is obsolete. In general, the later-dated material is better than the earlier material. Some specific hazards are indi~ated in the index below.


Item Type:Report or Paper (Technical Report)
Additional Information:Series numbering on title page: Technical Report #1438. Silicon Structures Project sponsored by Burroughs Corporation, Digital Equipment Corporation, Hewlett Packard Company, Honeywell Incorporated, International Business Machines Corporation, Intel Corporation, Xerox Corporation, and the National Science Foundation.
Group:Computer Science Technical Reports
Funders:
Funding AgencyGrant Number
Burroughs CorporationUNSPECIFIED
Digital Equipment CorporationUNSPECIFIED
Hewlett Packard CompanyUNSPECIFIED
Honeywell IncorporatedUNSPECIFIED
International Business Machines CorporationUNSPECIFIED
Intel CorporationUNSPECIFIED
Xerox CorporationUNSPECIFIED
NSFUNSPECIFIED
DOI:10.7907/Z9NG4NKX
Record Number:CaltechAUTHORS:20120418-103150565
Persistent URL:http://resolver.caltech.edu/CaltechAUTHORS:20120418-103150565
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:30160
Collection:CaltechCSTR
Deposited By: Kristin Buxton
Deposited On:18 Apr 2012 17:54
Last Modified:09 Mar 2018 22:22

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