The Polygon Package

Sutherland, Ivan E. (1978) The Polygon Package. Computer Science Technical Reports, 1978.1438. California Institute of Technology , Pasadena, CA. (Unpublished) https://resolver.caltech.edu/CaltechAUTHORS:20120418-103150565

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Abstract

The memoranda listed below describe the polygon package in its present state. For easy reference, these memoranda have been packaged together. Some of the material included is obsolete. In general, the later-dated material is better than the earlier material. Some specific hazards are indi~ated in the index below.

Item Type:

Report or Paper (Technical Report)

Additional Information:

Series numbering on title page: Technical Report #1438. Silicon Structures Project sponsored by Burroughs Corporation, Digital Equipment Corporation, Hewlett Packard Company, Honeywell Incorporated, International Business Machines Corporation, Intel Corporation, Xerox Corporation, and the National Science Foundation.

Group:

Computer Science Technical Reports

Funders:

Funding Agency	Grant Number
Burroughs Corporation	UNSPECIFIED
Digital Equipment Corporation	UNSPECIFIED
Hewlett Packard Company	UNSPECIFIED
Honeywell Incorporated	UNSPECIFIED
International Business Machines Corporation	UNSPECIFIED
Intel Corporation	UNSPECIFIED
Xerox Corporation	UNSPECIFIED
NSF	UNSPECIFIED

Series Name:

Computer Science Technical Reports

Issue or Number:

1978.1438

DOI:

10.7907/Z9NG4NKX

Record Number:

CaltechAUTHORS:20120418-103150565

Persistent URL:

https://resolver.caltech.edu/CaltechAUTHORS:20120418-103150565

Usage Policy:

No commercial reproduction, distribution, display or performance rights in this work are provided.

ID Code:

30160

Collection:

CaltechCSTR

Deposited By:

INVALID USER

Deposited On:

18 Apr 2012 17:54

Last Modified:

03 Oct 2019 03:48

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