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HotQC simulation of nanovoid growth under tension in copper

Ariza, M. P. and Romero, I. and Ponga, M. and Ortiz, M. (2012) HotQC simulation of nanovoid growth under tension in copper. International Journal of Fracture, 174 (1). pp. 75-85. ISSN 0376-9429. https://resolver.caltech.edu/CaltechAUTHORS:20120430-074243222

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Abstract

We apply the HotQC method of Kulkarni et al. (J Mech Phys Solids 56:1417–1449, 2008) to the study of quasistatic void growth in copper single crystals at finite temperature under triaxial expansion. The void is strained to 30% deformation at initial temperatures and nominal strain rates ranging from 150 to 600Kand from 2.5×10^5 to 2.5×10^(11) s^(−1), respectively. The interatomic potential used in the calculations is Johnson’s Embedded-Atom Method potential Johnson (Phys Rev B 37:3924–3931, 1988). The computed pressure versus volumetric strain is in close agreement with that obtained using molecular dynamics, which suggests that inertia effects are not dominant for the void size and conditions considered. Upon the attainment of a critical or cavitation strain of the order of 20%, dislocations are abruptly and profusely emitted from the void and the rate of growth of the void increases precipitously. Prior to cavitation, the crystal cools down due to the thermoelastic effect. Following cavitation dislocation emission causes rapid local heating in the vicinity of the void, which in turn sets up a temperature gradient and results in the conduction of heat away from the void. The cavitation pressure is found to be relatively temperature-insensitive at low temperatures and decreases markedly beyond a transition temperature of the order of 250 K.


Item Type:Article
Related URLs:
URLURL TypeDescription
http://dx.doi.org/10.1007/s10704-011-9660-4DOIUNSPECIFIED
http://www.springerlink.com/content/a4326m2275v024j1/?MUD=MPPublisherUNSPECIFIED
ORCID:
AuthorORCID
Ariza, M. P.0000-0003-0266-0216
Romero, I.0000-0003-0364-6969
Ponga, M.0000-0001-5058-1454
Ortiz, M.0000-0001-5877-4824
Additional Information:© 2011 Springer Science+Business Media B.V. Received: 7 September 2011. Accepted: 29 November 2011. Published online: 20 December 2011. We gratefully acknowledge the support of the Ministerio de Ciencia e Innovación of Spain (DPI2009- 14305-C02-01/02) and the support of the Consejería de Innovación of Junta de Andalucía (P09-TEP-4493). Support for this study was also provided by the Department of Energy National Nuclear Security Administration under Award Number DE-FC52-08NA28613 through Caltech’s ASC/PSAAP Center for the Predictive Modeling and Simulation ofHigh EnergyDensity Dynamic Response of Materials.
Funders:
Funding AgencyGrant Number
Ministerio de Ciencia e Innovaciόn (Spain)DP12009-14305-C02-01/02
Consejería de Innovación of Junta de AndaluciaP09-TEP4493
Department of Energy (DOE) National Nuclear Security AdministrationDE-FC52-08NA28613
Subject Keywords:Nanovoids; Cavitation; Dislocations; Quasicontinuum; Finite temperature; Copper; Ductile fracture
Issue or Number:1
Record Number:CaltechAUTHORS:20120430-074243222
Persistent URL:https://resolver.caltech.edu/CaltechAUTHORS:20120430-074243222
Official Citation:HotQC simulation of nanovoid growth under tension in copper M. P. Ariza, I. Romero, M. Ponga and M. Ortiz pp.75-85
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:30387
Collection:CaltechAUTHORS
Deposited By: Ruth Sustaita
Deposited On:30 Apr 2012 15:20
Last Modified:09 Mar 2020 13:19

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