Wieluński, L. S. and Lien, C. -D. and Liu, B. X. and Nicolet, M.-A. (1982) Improvement of thermally formed nickel silicide by ion irradiation. Journal of Vacuum Science and Technology, 20 (2). pp. 182-185. ISSN 0022-5355. doi:10.1116/1.571353. https://resolver.caltech.edu/CaltechAUTHORS:20120716-160347437
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Abstract
A significant improvement of the lateral uniformity of thermally formed Ni_(2)Si layers has been observed after low‐dose (10^(13)~3 × 10^(14) ion/cm^2) Xe irradiation of an As‐deposited Ni film. Measurements have also been made on samples that contained a thin impurity layer formed intentionally between the silicon substrate and the evaporated nickel film. The impurity layer was thick enough to prevent thermal silicide formation in unirradiated samples, but in irradiated samples, the silicide formation was not prevented. Similar results were obtained for As implantations. We attribute this effect to ion mixing of the interfacial layer. These results demonstrate that a low‐dose irradiation can render the process of silicide formation by thermal annealing more tolerant to interfacial impurities. The concept is of potential significance to VLSI technology.
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| Additional Information: | © 1982 American Vacuum Society. Received 14 August 1981; accepted 14 September 1981. The authors thank C. A. Evans, Jr., and R. D. Blattner, of Charles Evans & Associates, for the SIMS analysis of two samples to characterize the interfacial impurities. S. S. Lau, of the University of California at San Diego, contributed many helpful discussions; and G. B. Larrabee and S. Matteson, of Texas Instruments, encouraged us to proceed with this investigation. We gratefully acknowledge these contributions. The work was executed under the benevolent U. R. Fund of the Bohmische Physical Society (B. M. Ullrich). The implantation aspect of this study was financially supported by the U. S. Department of Energy through an agreement with the National Aeronautics and Space Administration and monitored by the Jet Propulsion Laboratory, California Institute of Technology (D. Bickler). | |||||||||
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| Subject Keywords: | nickel silicides; layers; low dose irradiation; xenon; high temperature; annealing; nickel; silicon; substrates; thin films; fabrication; implantation; arsenic | |||||||||
| Issue or Number: | 2 | |||||||||
| Classification Code: | PACS: 68.35.-p; 68.55.-a; 85.40.-e; 81.05.Bx | |||||||||
| DOI: | 10.1116/1.571353 | |||||||||
| Record Number: | CaltechAUTHORS:20120716-160347437 | |||||||||
| Persistent URL: | https://resolver.caltech.edu/CaltechAUTHORS:20120716-160347437 | |||||||||
| Official Citation: | Improvement of thermally formed nickel silicide by ion irradiation L. S. Wielunski, C-D. Lien, B. X. Liu, and M-A. Nicolet, J. Vac. Sci. Technol. 20, 182 (1982), DOI:10.1116/1.571353 | |||||||||
| Usage Policy: | No commercial reproduction, distribution, display or performance rights in this work are provided. | |||||||||
| ID Code: | 32488 | |||||||||
| Collection: | CaltechAUTHORS | |||||||||
| Deposited By: | INVALID USER | |||||||||
| Deposited On: | 17 Jul 2012 14:37 | |||||||||
| Last Modified: | 09 Nov 2021 21:27 |
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