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High yield packaging for high-density multi-channel chip integration on flexible parylene substrate

Chang, Jay-Han-Chieh and Kang, Dongyang and Tai, Yu-Chong (2012) High yield packaging for high-density multi-channel chip integration on flexible parylene substrate. In: 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems. IEEE , Piscataway, NJ, pp. 353-356. ISBN 978-1-4673-0325-5. https://resolver.caltech.edu/CaltechAUTHORS:20130201-084703276

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Abstract

This paper reports a new chip packaging technique for the assembly of retinal prosthesis device. Here, a photoresist is used as glue to attach a chip to the targeted parylene-C substrate so that 94% of the chip area is used as attachment to prevent delamination. As a validation, chips with 268 connections were used to assess the connection yield. The results show that this new technique, combined with an additional parylene-C coating, provide a high connection yield (>90%) and is a promising method for high-lead-count implant devices.


Item Type:Book Section
Related URLs:
URLURL TypeDescription
http://dx.doi.org/10.1109/MEMSYS.2012.6170160DOIUNSPECIFIED
http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6170160PublisherUNSPECIFIED
ORCID:
AuthorORCID
Tai, Yu-Chong0000-0001-8529-106X
Additional Information:© 2012 IEEE. Date of Current Version: 15 March 2012. This work is supported by Biomimetic MicroElectronic Systems (BMES). The authors would also like to thank Dr. Wentai Liu from UCSC for providing 268 channel retinal stimulation chips and Mr. Trevor Roper and other members of the Caltech Micromachining Laboratory for assistance with fabrication and fruitful discussion.
Funders:
Funding AgencyGrant Number
Biomimetic MicroElectronic Systems (BMES)UNSPECIFIED
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Other Numbering System NameOther Numbering System ID
INSPEC Accession Number12618007
Record Number:CaltechAUTHORS:20130201-084703276
Persistent URL:https://resolver.caltech.edu/CaltechAUTHORS:20130201-084703276
Official Citation:Chang, J.H.; Dongyang Kang; Yu-chong Tai; , "High yield packaging for high-density multi-channel chip integration on flexible parylene substrate," Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on , vol., no., pp.353-356, Jan. 29 2012-Feb. 2 2012 doi: 10.1109/MEMSYS.2012.6170160
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:36728
Collection:CaltechAUTHORS
Deposited By: Tony Diaz
Deposited On:27 Feb 2013 22:00
Last Modified:03 Oct 2019 04:40

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