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Thermal stress in silica-on-silicon disk resonators

Chen, Tong and Lee, Hansuek and Vahala, Kerry J. (2013) Thermal stress in silica-on-silicon disk resonators. Applied Physics Letters, 102 (3). Art. No. 031113. ISSN 0003-6951. https://resolver.caltech.edu/CaltechAUTHORS:20130226-152436926

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Abstract

The thermal expansion mismatch of thermal grown silica on a silicon wafer is well known to induce compressive stress upon cooling from the growth temperature to room temperature. In this Letter, we investigate how this stress impacts silica disk structures by comparison of measurements with both a finite element and an analytical model. The disk structures studied are also whispering gallery optical resonators, and proper control of stress is critical to obtain high-Q resonances. Based on our analysis, thicker oxide layers and proper control of undercut enable ultra-high-Q optical performance and mechanical stability.


Item Type:Article
Related URLs:
URLURL TypeDescription
http://dx.doi.org/10.1063/1.4789370DOIArticle
ORCID:
AuthorORCID
Lee, Hansuek0000-0002-0748-7662
Vahala, Kerry J.0000-0003-1783-1380
Additional Information:© 2013 American Institute of Physics. Received 4 December 2012; accepted 8 January 2013; published online 24 January 2013. We gratefully acknowledge the Defense Advanced Research Projects Agency under the iPhoD program, the Institute for Quantum Information and Matter, an NSF Physics Frontiers Center with support of the Gordon and Betty Moore Foundation, and also the Kavli Nanoscience Institute at Caltech. H.L. thanks the Center for the Physics of Information.
Group:Kavli Nanoscience Institute, Institute for Quantum Information and Matter
Funders:
Funding AgencyGrant Number
Gordon and Betty Moore FoundationUNSPECIFIED
Kavli Nanoscience InstituteUNSPECIFIED
Defense Advanced Research Projects Agency (DARPA)UNSPECIFIED
Institute for Quantum Information and Matter (IQIM)UNSPECIFIED
NSF Physics Frontiers CenterUNSPECIFIED
Subject Keywords:elemental semiconductors, finite element analysis, resonators, silicon, thermal expansion, thermal stresses
Issue or Number:3
Classification Code:PACS: 84.40.Az, 02.70.Dh. IPC: H01P1/00
Record Number:CaltechAUTHORS:20130226-152436926
Persistent URL:https://resolver.caltech.edu/CaltechAUTHORS:20130226-152436926
Official Citation:Thermal stress in silica-on-silicon disk resonators Tong Chen, Hansuek Lee, and Kerry J. Vahala Appl. Phys. Lett. 102, 031113 (2013); http://dx.doi.org/10.1063/1.4789370 (4 pages)
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:37157
Collection:CaltechAUTHORS
Deposited By: Ruth Sustaita
Deposited On:26 Feb 2013 23:38
Last Modified:04 Jun 2020 10:14

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