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In Situ Heating to Improve Adhesion for Parylene-on-Parylene Deposition

Kang, Dongyang and Chang, Jay Han-Chieh and Kim, Justin Young-Hyun and Tai, Yu-Chong (2012) In Situ Heating to Improve Adhesion for Parylene-on-Parylene Deposition. In: IEEE-NEMS 2012: 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems. IEEE , Piscataway, NJ, pp. 226-229. ISBN 978-1-4673-1122-9. https://resolver.caltech.edu/CaltechAUTHORS:20130409-145002735

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Abstract

A new technique of using “in-situ heating” to enhance adhesion for parylene-on-parylene deposition is reported in this paper. This method is compared with existing physical or chemical adhesion-enhancing methods and the results show clear advantages of this new technique. The physics is believed to be that the mobility of deposition-involved molecules (including the substrate parylene polymer chains and adsorbed monomers during deposition) is enhanced when deposition temperature rises, especially above the glass transition temperature of the substrate parylene. Each sample is patterned and then soaked in 0.9% saline at 90°C, and the undercut between two parylene layers due to the attack from saline during the soaking test could be observed. The undercut rate is measured to quantify the adhesion strength.


Item Type:Book Section
Related URLs:
URLURL TypeDescription
http://dx.doi.org/10.1109/NEMS.2012.6196762DOIUNSPECIFIED
http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6196762PublisherUNSPECIFIED
ORCID:
AuthorORCID
Tai, Yu-Chong0000-0001-8529-106X
Additional Information:© 2012 IEEE. This work is supported by Biomimetic MicroElectronic Systems (BMES). The authors would like to thank Mr. Trevor Roper and other members of the Cal tech Micromachining Laboratory for their generous help and useful advice.
Funders:
Funding AgencyGrant Number
Biomimetic MicroElectronic Systems (BMES)UNSPECIFIED
Subject Keywords:in-situ heating; PA-C substrate; adhesion; undercut
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Other Numbering System NameOther Numbering System ID
INSPEC Accession Number12725763
Record Number:CaltechAUTHORS:20130409-145002735
Persistent URL:https://resolver.caltech.edu/CaltechAUTHORS:20130409-145002735
Official Citation:Dongyang Kang; Chang, J.H.; Kim, J.Y.-H.; Yu-Chong Tai, "In situ heating to improve adhesion for parylene-on-parylene deposition," Nano/Micro Engineered and Molecular Systems (NEMS), 2012 7th IEEE International Conference on , vol., no., pp.226,229, 5-8 March 2012 doi: 10.1109/NEMS.2012.6196762
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:37835
Collection:CaltechAUTHORS
Deposited By: Ruth Sustaita
Deposited On:09 Apr 2013 22:22
Last Modified:03 Oct 2019 04:51

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