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Dry Mechanical Liftoff Technology for Metallization on Parylene-C Using SU-8

Chang, Jay Han-Chieh and Kang, Dongyang and Tai, Yu-Chong (2012) Dry Mechanical Liftoff Technology for Metallization on Parylene-C Using SU-8. In: IEEE-NEMS 2012: 2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems. IEEE , Piscataway, NJ, pp. 286-289. ISBN 978-1-4673-1122-9.

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This paper presents a new fabrication method to employ dry mechanical liftoff of SU-8 mask to pattern metals on parylene-C film. Soaking tests were done to examine the adhesion between SU-8 and parylene-C film with different interface treatments. SU-8 masks with different thickness were tested in order to find out the best trade-off between the feature sizes and the easiness of removal from paryelene-C film after metal deposition. Features from 10 μm to 300 μm in diameter and width were successfully patterned on parylene-C film by this method. The 15 μm thick SU-8 liftoff mask is highly flexible and can be peeled off mechanically from parylene-C film by tweezers seconds without any visible residue. Metal lines with testing pads from 10 μm to 100 μm wide and 1 cm long were also fabricated and tested to evaluate their resistances. This new method provides an alternative way of metallization on parylene-C film which benefits the application in MEMS area.

Item Type:Book Section
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Tai, Yu-Chong0000-0001-8529-106X
Additional Information:© 2012 IEEE. This work is supported by Biomimetic MicroElectronic Systems (BMES). The authors would also like to thank Dr. Wentai Liu from UCSC for providing 268 channel retinal stimulation chips and Mr. Trevor Roper and other members of the Caltech Micromachining Laboratory for assistance with fabrication and fruitful discussion.
Funding AgencyGrant Number
Biomimetic MicroElectronic Systems (BMES)UNSPECIFIED
Subject Keywords:parylene-C; liftoff; metallization; SU-8
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INSPEC Accession Number12725777
Record Number:CaltechAUTHORS:20130409-151812052
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Official Citation:Chang, J.H.; Dongyang Kang; Yu-Chong Tai, "Dry mechanical liftoff technology for metallization on parylene-C using SU-8," Nano/Micro Engineered and Molecular Systems (NEMS), 2012 7th IEEE International Conference on , vol., no., pp.286,289, 5-8 March 2012 doi: 10.1109/NEMS.2012.6196776
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:37837
Deposited By: Ruth Sustaita
Deposited On:09 Apr 2013 22:30
Last Modified:03 Oct 2019 04:51

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