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Thermal properties of wood-derived copper–silicon carbide composites fabricated via electrodeposition

Pappacena, K. E. and Johnson, M. T. and Wang, H. and Porter, W. D. and Faber, K. T. (2010) Thermal properties of wood-derived copper–silicon carbide composites fabricated via electrodeposition. Composites Science and Technology, 70 (3). pp. 478-484. ISSN 0266-3538. https://resolver.caltech.edu/CaltechAUTHORS:20140715-090151860

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Abstract

Copper–silicon carbide composites were fabricated by electrodeposition of copper into pores of wood-derived silicon carbide, a ceramic with a microstructure that can be tailored via the use of different wood precursors. Thermal conductivity values were determined using flash diffusivity at temperatures from 0 to 900 °C. Thermal conductivities of up to 202 W/mK at 0 °C and 148W/mK at 900 °C were achieved. Object-oriented finite-element analysis (OOF) modeling was used to understand the heat flux distributions throughout the microstructures. OOF was also used to calculate the effective thermal conductivity, which correlated well with experimentally-determined values for axially-oriented composites. In addition, OOF was used to predict effective conductivity values and heat flux distributions for transversely-oriented composites.


Item Type:Article
Related URLs:
URLURL TypeDescription
http://dx.doi.org/10.1016/j.compscitech.2009.11.011DOIArticle
http://www.sciencedirect.com/science/article/pii/S0266353809003972PublisherArticle
ORCID:
AuthorORCID
Johnson, M. T.0000-0002-3710-1070
Faber, K. T.0000-0001-6585-2536
Additional Information:© 2009 Elsevier Ltd. Received 25 August 2009; Accepted 11 November 2009; Available online 18 November 2009. This work was funded by the National Science Foundation (DMR-0710630). The authors would also like to acknowledge Edwin R. Fuller, Jr. National Institute of Standards and Technology) for his assistance with OOF. The SEM work was performed in the EPIC facilities of NUANCE Center at Northwestern University. NUANCE Center is supported by NSF-NSEC, NSF-MRSEC, Keck Foundation, the State of Illinois, and Northwestern University. Thermal diffusivity and specific heat experiments were sponsored by the Assistant Secretary for Energy Efficiency and Renewable Energy, Office of FreedomCAR and Vehicle Technologies, as part of the High Temperature Materials Laboratory User Program, Oak Ridge National Laboratory, managed by UT-Battelle, LLC, for the US Department of Energy under contract Number DE-AC05-00OR22725.
Funders:
Funding AgencyGrant Number
NSFDMR-0710630
W. M. Keck FoundationUNSPECIFIED
State of IllinoisUNSPECIFIED
Northwestern UniversityUNSPECIFIED
Oak Ridge National LaboratoryUNSPECIFIED
Department of Energy (DOE)DE-AC05-00OR22725
Subject Keywords:B. Thermal properties; C. Finite element analysis (FEA); A. Ceramic–matrix composites (CMCs); C. Anisotrophy; Thermal conductivity
Issue or Number:3
Record Number:CaltechAUTHORS:20140715-090151860
Persistent URL:https://resolver.caltech.edu/CaltechAUTHORS:20140715-090151860
Official Citation:Pappacena, K. E., Johnson, M. T., Wang, H., Porter, W. D., & Faber, K. T. (2010). Thermal properties of wood-derived copper–silicon carbide composites fabricated via electrodeposition. Composites Science and Technology, 70(3), 478-484. doi: http://dx.doi.org/10.1016/j.compscitech.2009.11.011
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:47206
Collection:CaltechAUTHORS
Deposited By: Jason Perez
Deposited On:15 Jul 2014 22:58
Last Modified:09 Mar 2020 13:18

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